Benefits to you are better adhesion or marking, cleaner parts with less labor and reduced chemical expense by eliminating unwelcome and often expensive chemical waste associated with cleaning and priming. The large all aluminum chamber accommodates a generously sized active processing surface, our standard configuration of five levels of processing shelves provides you with 2100 square inches of useable plasma processing area.
| Plasma Etch, Inc. | |
|---|---|
| Product Category | Thin Film Equipment |
| Product Number | BT-1 |
| Product Name | Reactive Ion Etching System |
| Type | Free Standing System |
| Process | Plasma Etching and Cleaning |
| Applications | Research / Surface Analysis; Printed Circuit Boards |
| Materials Processed | Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals |