Panasonic Thermal Interface Material, 61.5X91Mm; Thermal Conductivity Panasonic EYGS0609ZLSK

Description
THERMAL INTERFACE MATERIAL, 61.5X91MM; Thermal Conductivity:400W/m. K; Conductive Material:Graphite Sheet; Thickness:200µm; Thermal Impedance:-; Dielectric Strength:-; External Length:91mm; External Width:61.5mm; Product Range:EYGS RoHS Compliant: Yes
Datasheet
Description
THERMAL INTERFACE MATERIAL, 61.5X91MM; Thermal Conductivity:400W/m. K; Conductive Material:Graphite Sheet; Thickness:200µm; Thermal Impedance:-; Dielectric Strength:-; External Length:91mm; External Width:61.5mm; Product Range:EYGS RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Material, 61.5X91Mm; Thermal Conductivity Panasonic - 13AC3474 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Material, 61.5X91Mm; Thermal Conductivity Panasonic
13AC3474
Thermal Interface Material, 61.5X91Mm; Thermal Conductivity Panasonic 13AC3474
THERMAL INTERFACE MATERIAL, 61.5X91MM; Thermal Conductivity:400W/m. K; Conductive Material:Graphite Sheet; Thickness:200µm; Thermal Impedance:-; Dielectric Strength:-; External Length:91mm; External Width:61.5mm; Product Range:EYGS RoHS Compliant: Yes

THERMAL INTERFACE MATERIAL, 61.5X91MM; Thermal Conductivity:400W/m.K; Conductive Material:Graphite Sheet; Thickness:200µm; Thermal Impedance:-; Dielectric Strength:-; External Length:91mm; External Width:61.5mm; Product Range:EYGS RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 13AC3474
Product Name Thermal Interface Material, 61.5X91Mm; Thermal Conductivity Panasonic
Thermal Conductivity 400 W/m-K (231 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Fast cured insulating thermal silicone adhesive glue - TIV800-15 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
One Part, Toughened Epoxy for Dam-and-Fill Encapsulation - Supreme 3DM-85 - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Gap Filler, Foam in Place Gasket
View Details