MacDermid Alpha Electronics Solutions Precision Camera Module Adhesive Solutions ALPHA ® HiTech ® AD13-9692B

Product Overview A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal for applications in camera modules and other optical devices where low thermal exposure is critical, the AD13-9692B offers strong adhesion at temperatures low enough to prevent damage to sensitive components, while maintaining flexibility in automated manufacturing. Product Features Low-Temperature Cure Allows for effective bonding at temperatures as low as 80°C, reducing the risks of heat damage to sensitive components. Single-Component Adhesive Simplifies the manufacturing process by eliminating the need for mixing, helping to maintain consistent quality. High Adhesion on Diverse Substrates Compatible with substrates like stainless steel, polyimide, and Liquid Crystal Polymer (LCP), broadening its range of applications. Featured Applications Camera Modules Ensures stable adhesion for optical devices that require precise and reliable assembly under low-temperature conditions.