Palomar Technologies, Inc Triple Chamber Automated Vacuum Pressure Soldering System SST 8303

Description
Overview The SST 8303 is a single chamber, automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure. Featuring conveyor belts and a Cartesian gantry, the system provides high volume, high reliable packages through precise control of the soldering process. Available with a single or triple chamber, the system allows for heating up to 500°C and fast cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig using the QuikCool™ cooling unit. Key benefits of the SST 8303 include: Automated high-volume production vacuum pressure soldering system Enables low-void solder connections with preforms or with solder paste Offers maximum flexibility for processing a wide range of solder alloys and other alternative interconnect materials Each chamber of the SST 8303 runs a complete process allowing multiple processes to be run in parallel Flexible configuration for any production line: Triple Chamber: SST 8303 (Single Chamber available: SST 8301) Oxide removal technology using formic acid or forming gas Automation Robot The SST 8303 Automated Vacuum Pressure System can operate as a stand-alone unit or can be integrated into an automated production line. A Cartesian gantry system is used to automatically shuttle part carriers in/out of each chamber, performing each movement with high accuracy and precision. Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability power modules. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components. Applications Power Module Assembly IGBT/SiC/GaAs/GaN Die Attach Die Attach for Pressure Sensors Hermetic Sealing of IR Image Sensors High Power Laser Module Assembly Multilayer Ceramic Capacitors High Intensity LED Attach CPV Solar Cell Assembly Hermetic Sealing of Hi-Rel Packages Copper Clip Soldering
  • Triple Chamber Automated Vacuum Pressure Soldering System - SST 8303 - Palomar Technologies, Inc
    Palomar Technologies, Inc
Description
Overview The SST 8303 is a single chamber, automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure. Featuring conveyor belts and a Cartesian gantry, the system provides high volume, high reliable packages through precise control of the soldering process. Available with a single or triple chamber, the system allows for heating up to 500°C and fast cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig using the QuikCool™ cooling unit. Key benefits of the SST 8303 include: Automated high-volume production vacuum pressure soldering system Enables low-void solder connections with preforms or with solder paste Offers maximum flexibility for processing a wide range of solder alloys and other alternative interconnect materials Each chamber of the SST 8303 runs a complete process allowing multiple processes to be run in parallel Flexible configuration for any production line: Triple Chamber: SST 8303 (Single Chamber available: SST 8301) Oxide removal technology using formic acid or forming gas Automation Robot The SST 8303 Automated Vacuum Pressure System can operate as a stand-alone unit or can be integrated into an automated production line. A Cartesian gantry system is used to automatically shuttle part carriers in/out of each chamber, performing each movement with high accuracy and precision. Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability power modules. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components. Applications Power Module Assembly IGBT/SiC/GaAs/GaN Die Attach Die Attach for Pressure Sensors Hermetic Sealing of IR Image Sensors High Power Laser Module Assembly Multilayer Ceramic Capacitors High Intensity LED Attach CPV Solar Cell Assembly Hermetic Sealing of Hi-Rel Packages Copper Clip Soldering

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Triple Chamber Automated Vacuum Pressure Soldering System - SST 8303 - Palomar Technologies, Inc
Palomar Technologies, Inc
Carlsbad, CA, United States
Triple Chamber Automated Vacuum Pressure Soldering System
SST 8303
Triple Chamber Automated Vacuum Pressure Soldering System SST 8303
Overview The SST 8303 is a single chamber, automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure. Featuring conveyor belts and a Cartesian gantry, the system provides high volume, high reliable packages through precise control of the soldering process. Available with a single or triple chamber, the system allows for heating up to 500°C and fast cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig using the QuikCool™ cooling unit. Key benefits of the SST 8303 include: Automated high-volume production vacuum pressure soldering system Enables low-void solder connections with preforms or with solder paste Offers maximum flexibility for processing a wide range of solder alloys and other alternative interconnect materials Each chamber of the SST 8303 runs a complete process allowing multiple processes to be run in parallel Flexible configuration for any production line: Triple Chamber: SST 8303 (Single Chamber available: SST 8301) Oxide removal technology using formic acid or forming gas Automation Robot The SST 8303 Automated Vacuum Pressure System can operate as a stand-alone unit or can be integrated into an automated production line. A Cartesian gantry system is used to automatically shuttle part carriers in/out of each chamber, performing each movement with high accuracy and precision. Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability power modules. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components. Applications Power Module Assembly IGBT/SiC/GaAs/GaN Die Attach Die Attach for Pressure Sensors Hermetic Sealing of IR Image Sensors High Power Laser Module Assembly Multilayer Ceramic Capacitors High Intensity LED Attach CPV Solar Cell Assembly Hermetic Sealing of Hi-Rel Packages Copper Clip Soldering

Overview

The SST 8303 is a single chamber, automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure. Featuring conveyor belts and a Cartesian gantry, the system provides high volume, high reliable packages through precise control of the soldering process. Available with a single or triple chamber, the system allows for heating up to 500°C and fast cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig using the QuikCool™ cooling unit.

Key benefits of the SST 8303 include:

  • Automated high-volume production vacuum pressure soldering system
  • Enables low-void solder connections with preforms or with solder paste
  • Offers maximum flexibility for processing a wide range of solder alloys and other alternative interconnect materials
  • Each chamber of the SST 8303 runs a complete process allowing multiple processes to be run in parallel
  • Flexible configuration for any production line: Triple Chamber: SST 8303 (Single Chamber available: SST 8301)
  • Oxide removal technology using formic acid or forming gas

Automation Robot

The SST 8303 Automated Vacuum Pressure System can operate as a stand-alone unit or can be integrated into an automated production line. A Cartesian gantry system is used to automatically shuttle part carriers in/out of each chamber, performing each movement with high accuracy and precision.

Processes

Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability power modules.
Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.

Applications

  • Power Module Assembly
  • IGBT/SiC/GaAs/GaN Die Attach
  • Die Attach for Pressure Sensors
  • Hermetic Sealing of IR Image Sensors
  • High Power Laser Module Assembly
  • Multilayer Ceramic Capacitors
  • High Intensity LED Attach
  • CPV Solar Cell Assembly
  • Hermetic Sealing of Hi-Rel Packages
  • Copper Clip Soldering
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Technical Specifications

  Palomar Technologies, Inc
Product Category Die Bonders
Product Number SST 8303
Product Name Triple Chamber Automated Vacuum Pressure Soldering System
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