Nidec America Corporation Heat Sink, Bga, Fpgas, Double Sided Adhesive, Bga, 9.96 C/w, 6 Mm, 30 Mm, 30 Mm Rohs Compliant Cci CCI09

Name: Heat Sink, Bga, Fpgas, Double Sided Adhesive, Bga, 9.96 C/w, 6 Mm, 30 Mm, 30 Mm Rohs Compliant Cci
Brand: Nidec America Corporation

Description

Heat Sink, BGA, FPGAs, Double Sided Adhesive, BGA, 9.96 C/W, 6 mm, 30 mm, 30 mm RoHS Compliant: Yes

Datasheet

Description

Heat Sink, BGA, FPGAs, Double Sided Adhesive, BGA, 9.96 C/W, 6 mm, 30 mm, 30 mm RoHS Compliant: Yes

Datasheet

Suppliers

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Product

Description

Supplier Links

Chicago, IL, United States

Heat Sink, Bga, Fpgas, Double Sided Adhesive, Bga, 9.96 C/w, 6 Mm, 30 Mm, 30 Mm Rohs Compliant Cci
53M6988

Heat Sink, Bga, Fpgas, Double Sided Adhesive, Bga, 9.96 C/w, 6 Mm, 30 Mm, 30 Mm Rohs Compliant Cci 53M6988

Heat Sink, BGA, FPGAs, Double Sided Adhesive, BGA, 9.96 C/W, 6 mm, 30 mm, 30 mm RoHS Compliant: Yes

Supplier's Site

Datasheet

	Newark, An Avnet Company
Product Category	Heat Sinks
Product Number	53M6988
Product Name	Heat Sink, Bga, Fpgas, Double Sided Adhesive, Bga, 9.96 C/w, 6 Mm, 30 Mm, 30 Mm Rohs Compliant Cci

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ToneCooling Technology Co., Ltd

Specs

Device Passive Heat Sink; Active Heat Sink

L 113 mm (4.45 inch)

W 78 mm (3.07 inch)

Sensata Technologies

USUSTK LIMITED

Specs

Material Aluminum; Copper

Rego Electronics Inc.

Specs

Device Passive Heat Sink

L 10 to 58 mm (0.3937 to 2.26 inch)

W 19 to 225 mm (0.7480 to 8.86 inch)