Single high-speed switching diode encapsulated in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
Features and benefits
High switching speed: trr ≤ 4 ns
Low leakage current: IR ≤ 0.5 µA
Reverse voltage VR ≤ 100 V
Low capacitance Cd ≤ 1.5 pF
Ultra small SMD plastic package
Low package height of 0.37 mm
Suitable for Automatic Optical Inspection (AOI) of solder joint
Qualified according to AEC-Q101 and recommended for use in automotive applications
Applications
High-speed switching
General-purpose switching
Single high-speed switching diode encapsulated in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
Features and benefits
- High switching speed: trr ≤ 4 ns
- Low leakage current: IR ≤ 0.5 µA
- Reverse voltage VR ≤ 100 V
- Low capacitance Cd ≤ 1.5 pF
- Ultra small SMD plastic package
- Low package height of 0.37 mm
- Suitable for Automatic Optical Inspection (AOI) of solder joint
- Qualified according to AEC-Q101 and recommended for use in automotive applications
Applications
- High-speed switching
- General-purpose switching
