Murata Electronics Balun LDB311G2505E-423

Description
MULTI-LAY HYBRID BALUNS 1206
  • Balun - LDB311G2505E-423 - ODG (Origin Data Global)
    ODG (Origin Data Global)
Datasheet
Description
MULTI-LAY HYBRID BALUNS 1206
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Balun - LDB311G2505E-423 - ODG (Origin Data Global)
ODG (Origin Data Global)
Shenzhen, China
Balun
LDB311G2505E-423
Balun LDB311G2505E-423
MULTI-LAY HYBRID BALUNS 1206

MULTI-LAY HYBRID BALUNS 1206

Supplier's Site Datasheet
Shenzhen Shengyu Electronics Technology Limited
Futian, China
RF and Wireless - Balun
LDB311G2505E-423
RF and Wireless - Balun LDB311G2505E-423
MULTI-LAY HYBRID BALUNS 1206

MULTI-LAY HYBRID BALUNS 1206

Supplier's Site

Technical Specifications

  ODG (Origin Data Global) Shenzhen Shengyu Electronics Technology Limited
Product Category Network and Communication Chips Network and Communication Chips
Product Number LDB311G2505E-423 LDB311G2505E-423
Product Name Balun RF and Wireless - Balun
Package Type 1206 (3216 Metric)
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