multicomp PRO Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro MPGCSP30NS-200-0.5

Description
NON-SILICONE THERMAL PAD, 200X0.5MM, GRY ROHS COMPLIANT: YES
Datasheet
Description
NON-SILICONE THERMAL PAD, 200X0.5MM, GRY ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro - 41AH5859 - Newark, An Avnet Company
Chicago, IL, United States
Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro
41AH5859
Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro 41AH5859
NON-SILICONE THERMAL PAD, 200X0.5MM, GRY ROHS COMPLIANT: YES

NON-SILICONE THERMAL PAD, 200X0.5MM, GRY ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5859
Product Name Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
High Performance Thermal Gap Filler - SARCON® GR130A - Fujipoly® America Corp.
Specs
Form / Shape Pad; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Gap Fill 0.0118 to 0.0787 inch (0.3000 to 2 mm)
View Details
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 410 F (0 to 210 C)
View Details