multicomp PRO Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro MPGCSP30NS-200-0.5

Description
NON-SILICONE THERMAL PAD, 200X0.5MM, GRY ROHS COMPLIANT: YES
Datasheet
Description
NON-SILICONE THERMAL PAD, 200X0.5MM, GRY ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro - 41AH5859 - Newark, An Avnet Company
Chicago, IL, United States
Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro
41AH5859
Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro 41AH5859
NON-SILICONE THERMAL PAD, 200X0.5MM, GRY ROHS COMPLIANT: YES

NON-SILICONE THERMAL PAD, 200X0.5MM, GRY ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5859
Product Name Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Good elastic thermal conductive insulator for power supply - SC800-PI-2-K4 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
One component primer/adhesive for polyolefins, passes ISO 10993-5 test - X21Med - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Form / Shape Liquid; Primer
View Details