multicomp PRO Thermal Interface Pad, 150Mm X 100Mm X 1Mm Rohs Compliant Multicomp Pro MP008848

Description
THERMAL INTERFACE PAD, 150Mm x 100Mm x 1MM ROHS COMPLIANT: YES
Description
THERMAL INTERFACE PAD, 150Mm x 100Mm x 1MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 150Mm X 100Mm X 1Mm Rohs Compliant Multicomp Pro - 25AK3599 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 150Mm X 100Mm X 1Mm Rohs Compliant Multicomp Pro
25AK3599
Thermal Interface Pad, 150Mm X 100Mm X 1Mm Rohs Compliant Multicomp Pro 25AK3599
THERMAL INTERFACE PAD, 150Mm x 100Mm x 1MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 150Mm x 100Mm x 1MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3599
Product Name Thermal Interface Pad, 150Mm X 100Mm X 1Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

High-Reliability Thermoplastic Adhesives for Microelectronics - STAYSTIK ® 571 - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Thermoplastic / Hot Melt; Thermoset
Industry Electronics; Semiconductors, IC's
View Details
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed - SE3000 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Electronics
Features Flame Retardant; UL Rating
View Details
Pedigree® - 40 VTC-40F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Carbon Fiber Heat Spreaders for 5G Base Station - CSF25 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details