multicomp PRO Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro MP008806

Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1.5MM ROHS COMPLIANT: YES
  • Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro - 25AK3557 - Newark, An Avnet Company
    Newark, An Avnet Company
Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1.5MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro - 25AK3557 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro
25AK3557
Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro 25AK3557
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1.5MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 150Mm x 150Mm x 1.5MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3557
Product Name Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Thermal gel for the consumer electronics industry - SE400AB - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Thermal gel for the consumer electronics industry
SE400AB
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - Dissipator 745
745PT
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity - Supreme 121AOND - Master Bond, Inc.
Master Bond, Inc.
Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity
Supreme 121AOND
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Gap Filler, Foam in Place Gasket
View Details
Adhesives - 1810367 - RS Components, Ltd.
RS Components, Ltd.
Adhesives
1810367
Specs
Form / Shape Liquid; Liquid
View Details