multicomp PRO Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro MP008806

Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1.5MM ROHS COMPLIANT: YES
  • Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro - 25AK3557 - Newark, An Avnet Company
    Newark, An Avnet Company
Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1.5MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro - 25AK3557 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro
25AK3557
Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro 25AK3557
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1.5MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 150Mm x 150Mm x 1.5MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3557
Product Name Thermal Interface Pad, 150Mm X 150Mm X 1.5Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D
746D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
CHT USA Inc.
2-Part, Silicone Potting Compound and Encapsulant, UL Listed
QSil-563
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Extremely Compressible Thermal Gap Filler - SARCON® PG45A - Fujipoly® America Corp.
Fujipoly® America Corp.
Extremely Compressible Thermal Gap Filler
SARCON® PG45A
Specs
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Gap Fill 0.0591 to 0.0984 inch (1.5 to 2.5 mm)
View Details