MacDermid Alpha Electronics Solutions High-Reliability Thermoplastic Adhesives for Microelectronics STAYSTIK ® 672

Product Overview STAYSTIK 672 Thermoplastic Adhesive Film is designed for a range of electronic applications, offering excellent bonding at low process temperatures and a very low elastic modulus of 60,000 psi. Its high compliance allows for effective bonding between materials with significant differences in Thermal Expansion Coefficients (TCEs). STAYSTIK 672 is excellent for daughter card-to-board or heat sink attachment. Its unique reworkable formulation provides key advantages in applications where thermoset adhesives are typically less effective.