multicomp PRO Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro MP008805

Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1MM ROHS COMPLIANT: YES
  • Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro - 25AK3556 - Newark, An Avnet Company
    Newark, An Avnet Company
Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro - 25AK3556 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro
25AK3556
Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro 25AK3556
THERMAL INTERFACE PAD, 150Mm x 150Mm x 1MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 150Mm x 150Mm x 1MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3556
Product Name Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Electrolube ® HTSP Silicone Heat Transfer Compound Plus - - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Electrolube ® HTSP Silicone Heat Transfer Compound Plus
Specs
Type High Dielectric
Form / Shape Grease, Paste
Chemical System Silicone
View Details
One component, high temperature resistant epoxy system for bonding and sealing - EP17HTDA-1 - Master Bond, Inc.
Master Bond, Inc.
One component, high temperature resistant epoxy system for bonding and sealing
EP17HTDA-1
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
View Details