multicomp PRO Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro MP008802

Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES
Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro - 25AK3553 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro
25AK3553
Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro 25AK3553
THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3553
Product Name Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-85 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 450 F (0 to 232 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Industry Automotive; Electronics
View Details
Highly Conformable and Non-Flammable, Higher Thermal interface material - SARCON® PG80B - Fujipoly® America Corp.
Specs
Type High Dielectric
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
View Details