multicomp PRO Insulating Kit; Insulator Body Material Multicomp MK3306

Description
INSULATING KIT; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:1kV; Thickness:0.1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:Insulating Kit; Length:19mm RoHS Compliant: Yes
Description
INSULATING KIT; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:1kV; Thickness:0.1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:Insulating Kit; Length:19mm RoHS Compliant: Yes

Suppliers

Company
Product
Description
Supplier Links
Insulating Kit; Insulator Body Material Multicomp - 50P9593 - Newark, An Avnet Company
Chicago, IL, United States
Insulating Kit; Insulator Body Material Multicomp
50P9593
Insulating Kit; Insulator Body Material Multicomp 50P9593
INSULATING KIT; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:1kV; Thickness:0.1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:Insulating Kit; Length:19mm RoHS Compliant: Yes

INSULATING KIT; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:1kV; Thickness:0.1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:Insulating Kit; Length:19mm RoHS Compliant: Yes

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 50P9593
Product Name Insulating Kit; Insulator Body Material Multicomp
Unlock Full Specs
to access all available technical data

Similar Products

Thermally Conductive, Electrically Non-Conductive Silicone Meets NASA Low Outgassing Specifications - MasterSil 323AO-LO - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Gap Filler, Foam in Place Gasket
View Details
Pedigree® - 40 VTC-40F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Silicone-Free Thermal Gel Series - AE30-LT - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details