multicomp PRO Insulating Kit; Insulator Body Material Multicomp MK3306

Description
INSULATING KIT; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:1kV; Thickness:0.1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:Insulating Kit; Length:19mm RoHS Compliant: Yes
Description
INSULATING KIT; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:1kV; Thickness:0.1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:Insulating Kit; Length:19mm RoHS Compliant: Yes

Suppliers

Company
Product
Description
Supplier Links
Insulating Kit; Insulator Body Material Multicomp - 50P9593 - Newark, An Avnet Company
Chicago, IL, United States
Insulating Kit; Insulator Body Material Multicomp
50P9593
Insulating Kit; Insulator Body Material Multicomp 50P9593
INSULATING KIT; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:1kV; Thickness:0.1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:Insulating Kit; Length:19mm RoHS Compliant: Yes

INSULATING KIT; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:1kV; Thickness:0.1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:Insulating Kit; Length:19mm RoHS Compliant: Yes

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 50P9593
Product Name Insulating Kit; Insulator Body Material Multicomp
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-85 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 450 F (0 to 232 C)
View Details
Thermal Grease - 1805303 - RS Components, Ltd.
RS Components, Ltd.
Specs
Form / Shape Grease, Paste
Chemical System Silicone
View Details
Two Component, Silver Coated, Nickel Filled Epoxy - EP79 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Form / Shape Die Bonding Adhesives; Grease, Paste; Gap Filler, Foam in Place Gasket
Chemical System Epoxy
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details