The Solder Wire, 99.3/0.7 Sn/Cu, 250G from Multicomp is a lead-free solder wire designed for various soldering applications. It features a flux type that is no clean and rosin-based, ensuring minimal residue after soldering. The wire has an external diameter of 0.9 mm (0.035 inches) and a melting temperature of 227¬8C, making it suitable for a range of electronic assembly tasks. This product is RoHS compliant, aligning with environmental regulations. The solder wire is formulated to provide good wetting on copper and brass surfaces, and it is effective in both wave and reflow soldering processes. It is particularly advantageous for repair operations on cleaned boards, as it eliminates the need for additional cleaning.
SOLDER WIRE, 99.3/0.7 SN/CU, 250G; Leaded / Lead Free:Lead Free; Flux Type:No Clean and Rosin Flux; Solder Alloy:99.3, 0.7 Sn, Cu; External Diameter - Metric:0.9mm; External Diameter - Imperial:0.035"; Melting Temperature:227°C RoHS Compliant: Yes
| Newark, An Avnet Company | |
|---|---|
| Product Category | Welding, Brazing, and Soldering Equipment |
| Product Number | 15J7279 |
| Product Name | Solder Wire, 99.3/0.7 Sn/cu, 250G; Leaded / Lead Free Multicomp |
PP, PPn, PVDF, Poly-Flo, ECTFE, PFA(optional)
