Momentive Performance Materials Inc. Momentive RTV31 Red Potting & Encapsulating Compound - 1 pt Kit - Useful temperature range: -65 F to +500 F 9385

Description
Momentive red RTV31 potting & encapsulating compound is compatible with electric motors/transformers, rubber and low-melting point metals materials with a 24 hr cure time. Provides a 2 hr working time. Works in a mix ratio of 20:1.
Description
Momentive red RTV31 potting & encapsulating compound is compatible with electric motors/transformers, rubber and low-melting point metals materials with a 24 hr cure time. Provides a 2 hr working time. Works in a mix ratio of 20:1.

Suppliers

Company
Product
Description
Supplier Links
Momentive RTV31 Red Potting & Encapsulating Compound - 1 pt Kit - Useful temperature range: -65 F to +500 F - RTV31 RED 001 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Momentive RTV31 Red Potting & Encapsulating Compound - 1 pt Kit - Useful temperature range: -65 F to +500 F
RTV31 RED 001
Momentive RTV31 Red Potting & Encapsulating Compound - 1 pt Kit - Useful temperature range: -65 F to +500 F RTV31 RED 001
Momentive red RTV31 potting & encapsulating compound is compatible with electric motors/transformers, rubber and low-melting point metals materials with a 24 hr cure time. Provides a 2 hr working time. Works in a mix ratio of 20:1.

Momentive red RTV31 potting & encapsulating compound is compatible with electric motors/transformers, rubber and low-melting point metals materials with a 24 hr cure time. Provides a 2 hr working time. Works in a mix ratio of 20:1.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Encapsulants and Potting Compounds
Product Number RTV31 RED 001
Product Name Momentive RTV31 Red Potting & Encapsulating Compound - 1 pt Kit - Useful temperature range: -65 F to +500 F
Cure / Technology Room Temperature Vulcanizing or Curing
Unlock Full Specs
to access all available technical data

Similar Products

Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation - EP29LPTCHT - Master Bond, Inc.
Specs
Type High Dielectric; Thermally Conductive
Form / Function Gap Filler, Foam in Place Gasket; Liquid
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
View Details
Potting Compounds - 9184999 - RS Components, Ltd.
RS Components, Ltd.
Specs
Form / Function Can; Liquid
Chemical System Epoxy; Epoxy
View Details
ELAN-Cast® - E 617 FR Resin / C 161 FR Hardener - ELANTAS North America LLC
Specs
Type High Dielectric
Form / Function Liquid
Cure / Technology Thermoset; Two Component  
View Details
Potting Resin - EE3390-000 - TE Connectivity
Specs
Chemical System Two-Part Hydrocarbon Resin
View Details