Momentive Performance Materials Inc. Momentive RTV31 Red Potting & Encapsulating Compound - 1 pt Kit - Useful temperature range: -65 F to +500 F 9385

Description
Momentive red RTV31 potting & encapsulating compound is compatible with electric motors/transformers, rubber and low-melting point metals materials with a 24 hr cure time. Provides a 2 hr working time. Works in a mix ratio of 20:1.
Description
Momentive red RTV31 potting & encapsulating compound is compatible with electric motors/transformers, rubber and low-melting point metals materials with a 24 hr cure time. Provides a 2 hr working time. Works in a mix ratio of 20:1.

Suppliers

Company
Product
Description
Supplier Links
Momentive RTV31 Red Potting & Encapsulating Compound - 1 pt Kit - Useful temperature range: -65 F to +500 F - RTV31 RED 001 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Momentive RTV31 Red Potting & Encapsulating Compound - 1 pt Kit - Useful temperature range: -65 F to +500 F
RTV31 RED 001
Momentive RTV31 Red Potting & Encapsulating Compound - 1 pt Kit - Useful temperature range: -65 F to +500 F RTV31 RED 001
Momentive red RTV31 potting & encapsulating compound is compatible with electric motors/transformers, rubber and low-melting point metals materials with a 24 hr cure time. Provides a 2 hr working time. Works in a mix ratio of 20:1.

Momentive red RTV31 potting & encapsulating compound is compatible with electric motors/transformers, rubber and low-melting point metals materials with a 24 hr cure time. Provides a 2 hr working time. Works in a mix ratio of 20:1.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Encapsulants and Potting Compounds
Product Number RTV31 RED 001
Product Name Momentive RTV31 Red Potting & Encapsulating Compound - 1 pt Kit - Useful temperature range: -65 F to +500 F
Cure / Technology Room Temperature Vulcanizing or Curing
Unlock Full Specs
to access all available technical data

Similar Products

High Elongation, Two Component Epoxy System with Excellent Thermal Shock Resistance - EP110F8-3 - Master Bond, Inc.
Specs
Type High Dielectric; Thermally Conductive
Form / Function Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
Cure / Technology Thermoset; Two Component  
View Details
Potting Compounds - 159267 - RS Components, Ltd.
RS Components, Ltd.
Specs
Form / Function Dual Cartridge
Thermal Conductivity 0.3000 W/m-K (0.1733 BTU-ft/hr-ft²-F)
View Details
Formulations - Applications - Bonding - Tuffbond 42121 - 342121AB22 - Hernon Manufacturing, Inc.
Specs
Form / Function 50 ml (two component)
Chemical System Ceramic; Epoxy
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
ELANTAS PDG CONAPOXY FR-1046 Epoxy Encapsulant Black 1 gal Can - FR-1046 BLACK GAL - Ellsworth Adhesives
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Viscosity 17000 cP
View Details