Momentive Performance Materials Inc. Momentive RTV12A Clear Potting & Encapsulating Compound - 1 gal Pail 9348

Description
Momentive clear RTV12A potting & encapsulating compound is compatible with ceramic, metal and plastic materials with a 72 hr cure time.
Description
Momentive clear RTV12A potting & encapsulating compound is compatible with ceramic, metal and plastic materials with a 72 hr cure time.

Suppliers

Company
Product
Description
Supplier Links
Momentive RTV12A Clear Potting & Encapsulating Compound - 1 gal Pail - RTV12A CLEAR 01G - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Momentive RTV12A Clear Potting & Encapsulating Compound - 1 gal Pail
RTV12A CLEAR 01G
Momentive RTV12A Clear Potting & Encapsulating Compound - 1 gal Pail RTV12A CLEAR 01G
Momentive clear RTV12A potting & encapsulating compound is compatible with ceramic, metal and plastic materials with a 72 hr cure time.

Momentive clear RTV12A potting & encapsulating compound is compatible with ceramic, metal and plastic materials with a 72 hr cure time.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Encapsulants and Potting Compounds
Product Number RTV12A CLEAR 01G
Product Name Momentive RTV12A Clear Potting & Encapsulating Compound - 1 gal Pail
Cure / Technology Room Temperature Vulcanizing or Curing
Unlock Full Specs
to access all available technical data

Similar Products

Conformal Coatings - 1810383 - RS Components, Ltd.
Specs
Form / Function Pen; Encapsulant or Conformal Coating
Industry Pcbs
Use Temperature 14 to 104 F (-10 to 40 C)
View Details
Carbon Fiber Encapsulation - Wraptite® - Arnold Magnetic Technologies
Arnold Magnetic Technologies
Specs
Cure / Technology Wound in place or pressed on sleeve
Chemical System Include Carbon Fiber, Zylon Fiber And Glass Fiber Composites
Industry Aerospace; Automotive; OEM or Industrial; Oil and Gas
View Details
Conformal Coating Solutions for PCBAs - Electrolube ® PCM Peelable Coating Mask - MacDermid Alpha Electronics Solutions
Specs
Form / Function Encapsulant or Conformal Coating
Industry Electronics; Semiconductors, IC's
View Details
No Mix, Thermally Conductive Epoxy Adhesive - EP3RR-80 - Master Bond, Inc.
Specs
Type High Dielectric; Thermally Conductive
Form / Function Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill
Cure / Technology Thermoset; Single Component; Reactive or Moisture Cured
View Details