Momentive Performance Materials Inc. Momentive TSE392 Clear Potting & Encapsulating Compound - 333 ml 28272

Description
Momentive clear TSE392 potting & encapsulating compound is compatible with ceramic, copper, glass and plastic materials with a 7 day cure time.
  • Momentive TSE392 Clear Potting & Encapsulating Compound - 333 ml - TSE392-C 333M - R. S. Hughes Company, Inc.
    R. S. Hughes Company, Inc.
Description
Momentive clear TSE392 potting & encapsulating compound is compatible with ceramic, copper, glass and plastic materials with a 7 day cure time.

Suppliers

Company
Product
Description
Supplier Links
Momentive TSE392 Clear Potting & Encapsulating Compound - 333 ml - TSE392-C 333M - R. S. Hughes Company, Inc.
R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Momentive TSE392 Clear Potting & Encapsulating Compound - 333 ml
TSE392-C 333M
Momentive TSE392 Clear Potting & Encapsulating Compound - 333 ml TSE392-C 333M
Momentive clear TSE392 potting & encapsulating compound is compatible with ceramic, copper, glass and plastic materials with a 7 day cure time.

Momentive clear TSE392 potting & encapsulating compound is compatible with ceramic, copper, glass and plastic materials with a 7 day cure time.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Encapsulants and Potting Compounds
Product Number TSE392-C 333M
Product Name Momentive TSE392 Clear Potting & Encapsulating Compound - 333 ml
Thermal Conductivity 0.1800 W/m-K (0.1040 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Room Temperature Curing Epoxy System - EP21 - Master Bond, Inc.
Master Bond, Inc.
Room Temperature Curing Epoxy System
EP21
Specs
Form / Function Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket; Liquid
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
View Details
Formulations - Applications - Bonding - Tuffbond 65891 - 36589122AB - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Bonding - Tuffbond 65891
36589122AB
Specs
Form / Function 50 ml (two component)
Cure / Technology Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Elastomeric
View Details
Light-Curable Materials, Encapsulating, 9201-W - - Dymax
Dymax
Light-Curable Materials, Encapsulating, 9201-W
Specs
Form / Function Gel
Cure / Technology UV or Radiation Cured
Industry encapsulating wire bonds, chip-on-board, or chip-on-flex circuits
View Details
ELANTAS PDG CONATHANE EN-21 Polyurethane Encapsulant 5 gal Kit - EN-21 5-GAL KIT - Ellsworth Adhesives
ELANTAS North America LLC
ELANTAS PDG CONATHANE EN-21 Polyurethane Encapsulant 5 gal Kit
EN-21 5-GAL KIT
Specs
Cure / Technology Two Component  
Chemical System Polyurethane
Thermal Conductivity 7.10E-4 W/m-K (4.10E-4 BTU-ft/hr-ft²-F)
View Details