Oak-Mitsui Technologies - FaradFlex® Filled Dielectric MC xx T

This material is a filled dielectric which contains a high Dk ceramic powder. The thicknesses available include 25 and 16um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed circuits and other high technology applications. Our FaradFlex® laminates and resin coated capacitor foils provide the highest capacitance densities and most solution choices for embedded capacitance and ultra-thin material applications. In addition, FaradFlex® provides a very low impedance/ inductance power distribution path increasing the device efficiency and functionality at both lower and higher frequencies. Applications of MC16T, MC25ST, MC12TM, MC8TM: These products are typically used for discrete embedded capacitance. FaradFlex frees up design space by eliminating the need to place discrete capacitors on the surface of the PCB, Module, or chip package. Space is a premium on many of these devices and there are few or no locations to place a capacitor with its vias, pad, and traces. By using Faradflex the device is etched into the copper and located in the substrate. It also provides a very short impedance path for the charge to the device from directly beneath it. Examples: Memory module substrates, Folded Stacked Die packages, CA TV Filters, Power modules, Chip package substrates, RF Filter & Receiver Modules, RF Transmitter modules for WIFI & WIMAX