Gelest, Inc. (HYDROXYETHYLENEOXYPROPYLMETHYLSILOXANE)-(3,4-DIMETHOXYPHENYLPROPYL)METHYLSILOXANE-DIMETHYLSILOXANE TERPOLYMER, 1,000-2,000 cSt CMS-832

Description
Safety Packaging Under Nitrogen
Datasheet
Description
Safety Packaging Under Nitrogen
Datasheet

Suppliers

Company
Product
Description
Supplier Links
(HYDROXYETHYLENEOXYPROPYLMETHYLSILOXANE)-(3,4-DIMETHOXYPHENYLPROPYL)METHYLSILOXANE-DIMETHYLSILOXANE TERPOLYMER, 1,000-2,000 cSt - CMS-832 - Gelest, Inc.
Morrisville, PA, United States
(HYDROXYETHYLENEOXYPROPYLMETHYLSILOXANE)-(3,4-DIMETHOXYPHENYLPROPYL)METHYLSILOXANE-DIMETHYLSILOXANE TERPOLYMER, 1,000-2,000 cSt
CMS-832
(HYDROXYETHYLENEOXYPROPYLMETHYLSILOXANE)-(3,4-DIMETHOXYPHENYLPROPYL)METHYLSILOXANE-DIMETHYLSILOXANE TERPOLYMER, 1,000-2,000 cSt CMS-832
Safety Packaging Under Nitrogen

Safety


  • Packaging Under Nitrogen
Supplier's Site Datasheet

Technical Specifications

  Gelest, Inc.
Product Category Industrial Adhesives
Product Number CMS-832
Product Name (HYDROXYETHYLENEOXYPROPYLMETHYLSILOXANE)-(3,4-DIMETHOXYPHENYLPROPYL)METHYLSILOXANE-DIMETHYLSILOXANE TERPOLYMER, 1,000-2,000 cSt
Chemical System Silicone
Unlock Full Specs
to access all available technical data

Similar Products

One Component, Optically Clear UV Curable System - UV15-7LRI - Master Bond, Inc.
Specs
Cure / Technology Thermoset; UV or Radiation Cured; Single Component
Type / Form Liquid
Features High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
View Details
Fluon® Perfluoro Adhesive - EA-2000 - AGC Chemicals Americas, Inc.
AGC Chemicals Americas, Inc.
Specs
Chemical System PFA
Type / Form Pellets
Features Laminaes
View Details
Dymax Multi-Cure 984-LVUF UV Curing Conformal Coating Clear 15 L Pail - 984-LVUF 15 LITER PAIL - Ellsworth Adhesives
Specs
Cure / Technology Single Component
Substrate Compatibility Ceramic, Glass; Metal
Viscosity 150 cP
View Details
Formulations - Applications - Bonding - Tuffbond 315 - 3315AB22 - Hernon Manufacturing, Inc.
Specs
Chemical System Ceramic; Epoxy
Features Encapsulant, Potting Compound
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details