Gelest, Inc. (HYDROXYETHYLENEOXYPROPYLMETHYLSILOXANE)-(3,4-DIMETHOXYPHENYLPROPYL)METHYLSILOXANE-DIMETHYLSILOXANE TERPOLYMER, 1,000-2,000 cSt CMS-832

Description
Safety Packaging Under Nitrogen
Datasheet
Description
Safety Packaging Under Nitrogen
Datasheet

Suppliers

Company
Product
Description
Supplier Links
(HYDROXYETHYLENEOXYPROPYLMETHYLSILOXANE)-(3,4-DIMETHOXYPHENYLPROPYL)METHYLSILOXANE-DIMETHYLSILOXANE TERPOLYMER, 1,000-2,000 cSt - CMS-832 - Gelest, Inc.
Morrisville, PA, United States
(HYDROXYETHYLENEOXYPROPYLMETHYLSILOXANE)-(3,4-DIMETHOXYPHENYLPROPYL)METHYLSILOXANE-DIMETHYLSILOXANE TERPOLYMER, 1,000-2,000 cSt
CMS-832
(HYDROXYETHYLENEOXYPROPYLMETHYLSILOXANE)-(3,4-DIMETHOXYPHENYLPROPYL)METHYLSILOXANE-DIMETHYLSILOXANE TERPOLYMER, 1,000-2,000 cSt CMS-832
Safety Packaging Under Nitrogen

Safety


  • Packaging Under Nitrogen
Supplier's Site Datasheet

Technical Specifications

  Gelest, Inc.
Product Category Industrial Adhesives
Product Number CMS-832
Product Name (HYDROXYETHYLENEOXYPROPYLMETHYLSILOXANE)-(3,4-DIMETHOXYPHENYLPROPYL)METHYLSILOXANE-DIMETHYLSILOXANE TERPOLYMER, 1,000-2,000 cSt
Chemical System Silicone
Unlock Full Specs
to access all available technical data

Similar Products

UV-Curing Epoxy, NOA 1375, 6 gm Syringe - NOA-1375S - Newport MKS
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details
Heat Transfer Compound - T-85 - Thermon, Inc
Specs
Cure / Technology Single Component
Features Thermally Conductive
Use Temperature 32 to 450 F (0 to 232 C)
View Details
Two-component insulation thermal conductive gel for PCB - SE800AB - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Type / Form Gel
Features Thermally Conductive
View Details