Rapid increases in aerial densities of HDD (Hard Disk Drive) requires advanced patterning solutions for thin film head production.
This brings leading-edge semiconductor processes into the HDD industry as a breakthrough. Magnetic Head Etch System E-6000 Series: the EMCP (Electro Magnetically Coupled Plasma) etch system provides superior performance in profile control as well as in higher etching rate and selectivity compared to conventional ion-milling processes.
| Applicable wafer diameter | 150mm, 200mm |
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| Hitachi High Technologies America, Inc. | |
|---|---|
| Product Category | Wafer and Thin Film Instrumentation |
| Product Number | E-6000 Series |
| Product Name | Magnetic Head Etch System |
| Mounting / Loading | Floor |
