128MX8/32MX16 Mcp Plastic Wireless Temp Pbf Tfbga 3.0V Product overview: NANDA9W3N4BZBB5F from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 3.0V. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 3.0V, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-NANDA9W3N4BZBB5F
Manufacturer: Micron Technology Inc.
Storage Condition: Dry storage cabinet & Humidity protection package
Win Source Part Number: 1081530-NANDA9W3N4BZ
Mounting: SMD (SMT)
Categories: Flash
Case / Package: TFBGA
Popularity: Low
Fake Threat In the Open Market: 51 pct.
Supply and Demand Status: Shortage
RoHS: Compliant
| ERSAELECTRONICS PTE. LTD. | Win Source Electronics | |
|---|---|---|
| Product Category | Memory Chips | Memory Chips |
| Product Number | 774-NANDA9W3N4BZBB5F | 1081530-NANDA9W3N4BZBB5F |
| Product Name | 3.0V Memory IC and Storage Component | Memory - Flash - NANDA9W3N4BZBB5F |
| Package Type | TFBGA | BGA; TFBGA |
