Microchip Technology, Inc. FET, MOSFET Arrays MSCSM170DUM11T3AG

Description
Mosfet Array 2 N-Channel (Dual) Common Source 1700V (1.7kV) 240A (Tc) 1140W (Tc) Chassis Mount SP3F
  • FET, MOSFET Arrays - 150-MSCSM170DUM11T3AG-ND - DigiKey
    DigiKey
  • Discrete Semiconductor Products - Transistors - FETs, MOSFETs - MSCSM170DUM11T3AG - Acme Chip Technology Co., Limited
    Acme Chip Technology Co., Limited
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Description
Mosfet Array 2 N-Channel (Dual) Common Source 1700V (1.7kV) 240A (Tc) 1140W (Tc) Chassis Mount SP3F
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
FET, MOSFET Arrays - 150-MSCSM170DUM11T3AG-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
FET, MOSFET Arrays
150-MSCSM170DUM11T3AG-ND
FET, MOSFET Arrays 150-MSCSM170DUM11T3AG-ND
Mosfet Array 2 N-Channel (Dual) Common Source 1700V (1.7kV) 240A (Tc) 1140W (Tc) Chassis Mount SP3F

Mosfet Array 2 N-Channel (Dual) Common Source 1700V (1.7kV) 240A (Tc) 1140W (Tc) Chassis Mount SP3F

Buy Now Datasheet
Richardson RFPD
Downers Grove, IL, United States
Silicon Carbide MOSFET Modules
MSCSM170DUM11T3AG
Silicon Carbide MOSFET Modules MSCSM170DUM11T3AG
The MSCSM170DUM11T3AG device is a 1700V/240A dual common source silicon carbide (SiC) MOSFET power module. Features SiC Power MOSFET: Low RDS(on), High temperature performance Kelvin source for easy drive Low stray inductance High level of integration Aluminum Nitride (AlN) substrate for improved thermal performance Internal thermistor for temperature monitoring Benefits Outstanding performance at high frequency operation Direct mounting to heatsink (isolated package) Low junction-to-case thermal resistance Low profile RoHS compliant Solderable terminals both for power and signal for easy PCB mounting Applications AC switches

The MSCSM170DUM11T3AG device is a 1700V/240A dual common source silicon carbide (SiC) MOSFET power module.

Features

  • SiC Power MOSFET: Low RDS(on), High temperature performance
  • Kelvin source for easy drive
  • Low stray inductance
  • High level of integration
  • Aluminum Nitride (AlN) substrate for improved thermal performance
  • Internal thermistor for temperature monitoring

Benefits

  • Outstanding performance at high frequency operation
  • Direct mounting to heatsink (isolated package)
  • Low junction-to-case thermal resistance
  • Low profile
  • RoHS compliant
  • Solderable terminals both for power and signal for easy PCB mounting

Applications

  • AC switches
Supplier's Site Datasheet
Discrete Semiconductor Products - Transistors - FETs, MOSFETs - MSCSM170DUM11T3AG - Acme Chip Technology Co., Limited
Acme Chip Technology Co., Limited
Shenzhen, China
Discrete Semiconductor Products - Transistors - FETs, MOSFETs
MSCSM170DUM11T3AG
Discrete Semiconductor Products - Transistors - FETs, MOSFETs MSCSM170DUM11T3AG
SIC 2N-CH 1700V 240A SP3F

SIC 2N-CH 1700V 240A SP3F

Supplier's Site

Technical Specifications

  DigiKey Richardson RFPD Acme Chip Technology Co., Limited
Product Category Transistors Metal-Oxide Semiconductor FET (MOSFET) RF Transistors
Product Number 150-MSCSM170DUM11T3AG-ND MSCSM170DUM11T3AG MSCSM170DUM11T3AG
Product Name FET, MOSFET Arrays Silicon Carbide MOSFET Modules Discrete Semiconductor Products - Transistors - FETs, MOSFETs
Package Type Module SP3F Module
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