Features
SiC Schottky Diode
IGBT4
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Richardson RFPD
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Description
Features
SiC Schottky Diode
IGBT4
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Request a Quote
Email Supplier
Datasheet
Datasheet Summary Powered by GS/AI
The MSCGLQ75X065CTYZBNMG is a three-phase bridge, brake, soft start, and solenoid power module with a 150 g AlSiC base plate and Si₃N₄ substrate in an isolated package suitable for direct heatsink mounting. It includes an internal thermistor and is RoHS compliant. The main IGBTs are rated for 650 V and 75 A continuous current with 0.51 °C/W junction-to-case thermal resistance; the soft start IGBT handles 100 A with 0.37 °C/W; the solenoid IGBTs support 1200 V and 15 A with 1.85 °C/W. SiC diodes support 700 V reverse voltage with junction-to-case thermal resistance of 1.75 °C/W for the main diodes and 4.69 °C/W for solenoid diodes. The operating junction temperature range is -55 °C to 175 °C, and the storage temperature range is -60 °C to 125 °C.
Datasheet Summary Powered by GS/AI
The MSCGLQ75X065CTYZBNMG is a three-phase bridge, brake, soft start, and solenoid power module with a 150 g AlSiC base plate and Si₃N₄ substrate in an isolated package suitable for direct heatsink mounting. It includes an internal thermistor and is RoHS compliant. The main IGBTs are rated for 650 V and 75 A continuous current with 0.51 °C/W junction-to-case thermal resistance; the soft start IGBT handles 100 A with 0.37 °C/W; the solenoid IGBTs support 1200 V and 15 A with 1.85 °C/W. SiC diodes support 700 V reverse voltage with junction-to-case thermal resistance of 1.75 °C/W for the main diodes and 4.69 °C/W for solenoid diodes. The operating junction temperature range is -55 °C to 175 °C, and the storage temperature range is -60 °C to 125 °C.
Features
SiC Schottky Diode
IGBT4
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Features
SiC Schottky Diode
IGBT4
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
