IGBT 3 fast
Low voltage drop
Low leakage current
Low switching losses
Kelvin emitter for easy drive
Low stray inductance
Stable temperature behavior
Very rugged
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Internal thermistor for temperature monitoring (optional)
Easy paralleling due to positive TC of VCEsat
Low profile
RoHS Compliant
Additional Features
Configuration: Full bridge
VCES (V): 650
VCESat (V): 1.85
Current (A) Tc=80C: 100
Silicon type: TRENCH 3 FAST
Package: SP3F
Microchip Technology, Inc.
Done
Datasheet
Description
IGBT 3 fast
Low voltage drop
Low leakage current
Low switching losses
Kelvin emitter for easy drive
Low stray inductance
Stable temperature behavior
Very rugged
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Internal thermistor for temperature monitoring (optional)
Easy paralleling due to positive TC of VCEsat
Low profile
RoHS Compliant
Additional Features
Configuration: Full bridge
VCES (V): 650
VCESat (V): 1.85
Current (A) Tc=80C: 100
Silicon type: TRENCH 3 FAST
Package: SP3F
IGBT 3 fast
Low voltage drop
Low leakage current
Low switching losses
Kelvin emitter for easy drive
Low stray inductance
Stable temperature behavior
Very rugged
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Internal thermistor for temperature monitoring (optional)
Easy paralleling due to positive TC of VCEsat
Low profile
RoHS Compliant
Additional Features
Configuration: Full bridge
VCES (V): 650
VCESat (V): 1.85
Current (A) Tc=80C: 100
Silicon type: TRENCH 3 FAST
Package: SP3F
IGBT 3 fast
Low voltage drop
Low leakage current
Low switching losses
Kelvin emitter for easy drive
Low stray inductance
Stable temperature behavior
Very rugged
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Internal thermistor for temperature monitoring (optional)
