Master Bond EP55TCFL is a thermally conductive, electrically isolating epoxy for bonding, sealing and coating, available as either a two part system or a one part premixed and frozen system.
Good flexibility and toughness
Flows smoothly and readily
Low modulus
Meets NASA low outgassing specifications
Regardless of packaging, the cured properties are the same. Both versions are thermally conductive and electrically isolating, with a moderate viscosity that spreads evenly and smoothly when bonding. Curing is also the same, with two cure schedule options: 4-6 hours at 50-70°C or 3-4 hours at 80-90°C. The system has outstanding dimensional stability, no solvents or diluents, and low shrinkage upon curing.
The two part system is packaged in 1, 4, and 8 ounce jars and requires hand mixing at a ratio of 100:15 by weight. It should be stored in a refrigerator at 40-50°F and has a shelf life of 3 months. No special shipping conditions are required, and the two part system is reusable, returning to the refrigerator for storage between uses.
The one part system is premixed and frozen, packaged in syringes of 3 cc, 5 cc, or 10 cc for single use. It must be stored in a cryogenic freezer at -40°C and has a shelf life of 6 months. It is shipped at -40°C with dry ice. Prior to use, the syringe must be removed from the freezer and allowed to reach room temperature; once thawed, it should not be returned to the freezer, and under no circumstances is the one part system reusable.
Packaging: two part in 1, 4, and 8 oz jars; one part in 3 cc, 5 cc, or 10 cc single-use syringes
Mix ratio (two part): 100:15 by weight, hand mixed
Storage: two part refrigerated at 40-50°F, 3 month shelf life; one part cryogenically frozen at -40°C, 6 month shelf life
Cure schedule: 4-6 hours at 50-70°C, or 3-4 hours at 80-90°C
Service temperature range: -50°C to +125°C
Color: gray
Bonds well to metals, composites, ceramics and many plastics
Good resistance to water, oils and fuels
EP55TCFL has good flow properties, making it well-suited for small potting and encapsulation applications, where it can be applied in layers up to 1/4 inch thick. Its special thermally conductive filler with small particle sizes allows it to be applied in very thin bond lines, resulting in lower thermal resistance and increased heat transfer. This makes it a highly effective thermal interface material for bonding applications in microelectronic packaging and assembly.
Product Advantages
High thermal conductivity and electrically insulating
Good flexibility, withstands thermal cycling
Versatile cure schedules
Small particle size lowers thermal resistance
NASA low outgassing
Master Bond EP55TCFL is a thermally conductive, electrically isolating epoxy for bonding, sealing and coating, available as either a two part system or a one part premixed and frozen system.
- Good flexibility and toughness
- Flows smoothly and readily
- Low modulus
- Meets NASA low outgassing specifications
Regardless of packaging, the cured properties are the same. Both versions are thermally conductive and electrically isolating, with a moderate viscosity that spreads evenly and smoothly when bonding. Curing is also the same, with two cure schedule options: 4-6 hours at 50-70°C or 3-4 hours at 80-90°C. The system has outstanding dimensional stability, no solvents or diluents, and low shrinkage upon curing.
The two part system is packaged in 1, 4, and 8 ounce jars and requires hand mixing at a ratio of 100:15 by weight. It should be stored in a refrigerator at 40-50°F and has a shelf life of 3 months. No special shipping conditions are required, and the two part system is reusable, returning to the refrigerator for storage between uses.
The one part system is premixed and frozen, packaged in syringes of 3 cc, 5 cc, or 10 cc for single use. It must be stored in a cryogenic freezer at -40°C and has a shelf life of 6 months. It is shipped at -40°C with dry ice. Prior to use, the syringe must be removed from the freezer and allowed to reach room temperature; once thawed, it should not be returned to the freezer, and under no circumstances is the one part system reusable.
- Packaging: two part in 1, 4, and 8 oz jars; one part in 3 cc, 5 cc, or 10 cc single-use syringes
- Mix ratio (two part): 100:15 by weight, hand mixed
- Storage: two part refrigerated at 40-50°F, 3 month shelf life; one part cryogenically frozen at -40°C, 6 month shelf life
- Cure schedule: 4-6 hours at 50-70°C, or 3-4 hours at 80-90°C
- Service temperature range: -50°C to +125°C
- Color: gray
- Bonds well to metals, composites, ceramics and many plastics
- Good resistance to water, oils and fuels
EP55TCFL has good flow properties, making it well-suited for small potting and encapsulation applications, where it can be applied in layers up to 1/4 inch thick. Its special thermally conductive filler with small particle sizes allows it to be applied in very thin bond lines, resulting in lower thermal resistance and increased heat transfer. This makes it a highly effective thermal interface material for bonding applications in microelectronic packaging and assembly.
Product Advantages
- High thermal conductivity and electrically insulating
- Good flexibility, withstands thermal cycling
- Versatile cure schedules
- Small particle size lowers thermal resistance
- NASA low outgassing
