MACOM RF Power Transistor NPT25100B

Description
Built using the SIGANTIC® NRF1 process - A proprietary GaN-on-Silicon technology
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Description
Built using the SIGANTIC® NRF1 process - A proprietary GaN-on-Silicon technology
Request a Quote
Datasheet
Datasheet Summary
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The NPT25100B is a GaN on silicon HEMT D-Mode power amplifier designed for 2.1 to 2.7 GHz operation, delivering 90 W CW output power and 125 W peak envelope power with 16.5 dB gain and 26% drain efficiency at 28 V. It is housed in a standard flange package with thermally enhanced design and gold metallization for high reliability. The device operates from -40°C to +85°C and meets RoHS compliance. Thermal resistance is 1.75 °C/W, and it is rated for 100 V drain-source voltage with a maximum junction temperature of 200°C.

Datasheet Summary
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The NPT25100B is a GaN on silicon HEMT D-Mode power amplifier designed for 2.1 to 2.7 GHz operation, delivering 90 W CW output power and 125 W peak envelope power with 16.5 dB gain and 26% drain efficiency at 28 V. It is housed in a standard flange package with thermally enhanced design and gold metallization for high reliability. The device operates from -40°C to +85°C and meets RoHS compliance. Thermal resistance is 1.75 °C/W, and it is rated for 100 V drain-source voltage with a maximum junction temperature of 200°C.

Suppliers

Company
Product
Description
Supplier Links
RF Power Transistor - NPT25100B - Richardson RFPD
Downers Grove, IL, United States
RF Power Transistor
NPT25100B
RF Power Transistor NPT25100B
Built using the SIGANTIC® NRF1 process - A proprietary GaN-on-Silicon technology

Built using the SIGANTIC® NRF1 process - A proprietary GaN-on-Silicon technology

Supplier's Site Datasheet

Technical Specifications

  Richardson RFPD
Product Category RF Transistors
Product Number NPT25100B
Product Name RF Power Transistor
Transistor Technology / Material GaN
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