The MMIX4G20N250 is a high-voltage IGBT module in an SMPD-Y surface-mount package, configured as an H-bridge with four transistors rated for 2500 V collector-emitter voltage and 23 A continuous collector current at 25 °C. It features a Direct-Copper Bond substrate with 4000 VAC electrical isolation, a low saturation voltage of 3.1 V at 20 A, and an isolated top-side mounting tab for heat sink attachment. The package measures 25.25 mm by 23.25 mm, weighs 8 g, and meets UL 94 V-0 flammability requirements. Thermal resistance from junction to case is 1.25 K/W. The device is qualified for operation from -55 °C to 150 °C junction temperature.
Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines. Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability
| Littelfuse, Inc. | |
|---|---|
| Product Category | Insulated Gate Bipolar Transistors (IGBT) |
| Product Number | MMIX4G20N250 |
| Product Name | 600V - 2500V Surface Mount Power Device (SMPD) Packages |
| VCES | 2500 volts |
