Littelfuse, Inc. 600V - 2500V Surface Mount Power Device (SMPD) Packages MMIX1Y100N120C3H1

Description
Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines. Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability
Description
Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines. Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability
Datasheet
Datasheet Summary
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The MMIX1Y100N120C3H1 is a 1200V XPT TM IGBT with an integrated ultra-fast diode, designed for high-frequency switching applications up to 50 kHz. It is packaged in an international standard surface-mountable case with an isolated mounting tab and weighs 8 g. The device has a continuous collector current rating of 40 A at 110°C and a collector-emitter saturation voltage of 3.5 V at 100 A and 15 V gate drive. It features 2500 V~ electrical isolation, a square RBSOA, and a positive thermal coefficient of VCE(sat). Thermal resistance from junction to case is 0.31 °C/W. The IGBT is avalanche rated and suitable for power inverters, motor drives, UPS, SMPS, PFC circuits, battery chargers, welding machines, and lamp ballasts.

Datasheet Summary
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The MMIX1Y100N120C3H1 is a 1200V XPT TM IGBT with an integrated ultra-fast diode, designed for high-frequency switching applications up to 50 kHz. It is packaged in an international standard surface-mountable case with an isolated mounting tab and weighs 8 g. The device has a continuous collector current rating of 40 A at 110°C and a collector-emitter saturation voltage of 3.5 V at 100 A and 15 V gate drive. It features 2500 V~ electrical isolation, a square RBSOA, and a positive thermal coefficient of VCE(sat). Thermal resistance from junction to case is 0.31 °C/W. The IGBT is avalanche rated and suitable for power inverters, motor drives, UPS, SMPS, PFC circuits, battery chargers, welding machines, and lamp ballasts.

Suppliers

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600V - 2500V Surface Mount Power Device (SMPD) Packages - MMIX1Y100N120C3H1 - Littelfuse, Inc.
Rosemont, IL, United States
600V - 2500V Surface Mount Power Device (SMPD) Packages
MMIX1Y100N120C3H1
600V - 2500V Surface Mount Power Device (SMPD) Packages MMIX1Y100N120C3H1
Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines. Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability

Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines. Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number MMIX1Y100N120C3H1
Product Name 600V - 2500V Surface Mount Power Device (SMPD) Packages
VCES 1200 volts
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