Littelfuse, Inc. 600V - 2500V Surface Mount Power Device (SMPD) Packages MMIX1X340N65B4

Description
Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines. Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability
Description
Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines. Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability
Datasheet
Datasheet Summary
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The MMIX1X340N65B4 is a 650V IGBT in an isolated tab package weighing 8 g, designed for switching applications from 10 to 30 kHz with low conduction and switching losses. It supports a continuous collector current of 295 A at 90°C and a peak pulse current of 1200 A at 25°C. The device features a square RBSOA, short-circuit capability, and an electrically isolated mounting surface rated for 2500 V~. Thermal resistance from junction to case is 0.125 °C/W. It is qualified for operation from -55°C to +175°C, with a maximum lead temperature for soldering of 260°C for 10 seconds. The IGBT is optimized for use in power inverters, UPS, motor drives, SMPS, PFC circuits, battery chargers, welding machines, and lamp ballasts.

Datasheet Summary
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The MMIX1X340N65B4 is a 650V IGBT in an isolated tab package weighing 8 g, designed for switching applications from 10 to 30 kHz with low conduction and switching losses. It supports a continuous collector current of 295 A at 90°C and a peak pulse current of 1200 A at 25°C. The device features a square RBSOA, short-circuit capability, and an electrically isolated mounting surface rated for 2500 V~. Thermal resistance from junction to case is 0.125 °C/W. It is qualified for operation from -55°C to +175°C, with a maximum lead temperature for soldering of 260°C for 10 seconds. The IGBT is optimized for use in power inverters, UPS, motor drives, SMPS, PFC circuits, battery chargers, welding machines, and lamp ballasts.

Suppliers

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Supplier Links
600V - 2500V Surface Mount Power Device (SMPD) Packages - MMIX1X340N65B4 - Littelfuse, Inc.
Rosemont, IL, United States
600V - 2500V Surface Mount Power Device (SMPD) Packages
MMIX1X340N65B4
600V - 2500V Surface Mount Power Device (SMPD) Packages MMIX1X340N65B4
Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines. Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability

Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines. Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number MMIX1X340N65B4
Product Name 600V - 2500V Surface Mount Power Device (SMPD) Packages
VCES 650 volts
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