Littelfuse, Inc. 600V - 2500V Surface Mount Power Device (SMPD) Packages MMIX1G320N60B3

Description
Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines. Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability
Description
Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines. Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability
Datasheet
Datasheet Summary
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The MMIX1G320N60B3 is a 600V IGBT in an isolated tab package with a 600V collector-emitter voltage rating and a 400A continuous collector current at 25°C. It features a low saturated voltage of 1.20 to 1.50V at 100A and 1.67V at 320A, optimized for 5-40 kHz switching with a square RBSOA. The device has a silicon chip on direct-copper bond (DCB) substrate, 2500 V~ electrical isolation, and a thermal resistance of 0.125°C/W from junction to case. It is rated for a junction temperature range of -55°C to 150°C and meets RoHS standards. The package has 24 pins with isolated emitter and collector terminals, designed for surface-mount assembly with a weight of 8 g.

Datasheet Summary
Powered by GS/AI

The MMIX1G320N60B3 is a 600V IGBT in an isolated tab package with a 600V collector-emitter voltage rating and a 400A continuous collector current at 25°C. It features a low saturated voltage of 1.20 to 1.50V at 100A and 1.67V at 320A, optimized for 5-40 kHz switching with a square RBSOA. The device has a silicon chip on direct-copper bond (DCB) substrate, 2500 V~ electrical isolation, and a thermal resistance of 0.125°C/W from junction to case. It is rated for a junction temperature range of -55°C to 150°C and meets RoHS standards. The package has 24 pins with isolated emitter and collector terminals, designed for surface-mount assembly with a weight of 8 g.

Suppliers

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600V - 2500V Surface Mount Power Device (SMPD) Packages - MMIX1G320N60B3 - Littelfuse, Inc.
Rosemont, IL, United States
600V - 2500V Surface Mount Power Device (SMPD) Packages
MMIX1G320N60B3
600V - 2500V Surface Mount Power Device (SMPD) Packages MMIX1G320N60B3
Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines. Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability

Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines. Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number MMIX1G320N60B3
Product Name 600V - 2500V Surface Mount Power Device (SMPD) Packages
VCES 600 volts
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