Littelfuse, Inc. 40V - 1100V HiPerFETs and MOSFETs in Surface Mount Power Device (SMPD) Packages MMIX1F360N15T2

Description
Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices. Configurations: Buck Boost Full-bridge Half-bridge Phase leg Single Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability
Description
Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices. Configurations: Buck Boost Full-bridge Half-bridge Phase leg Single Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability
Datasheet
Datasheet Summary
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The MMIX1F360N15T2 is an N-channel enhancement mode power MOSFET with a 150 V drain-source breakdown voltage and a continuous drain current of 235 A at 25°C, designed for high-speed switching in DC-DC converters and UPS applications. It features a very low on-resistance of 4.4 mΩ, an isolated tab with 2500 V~ dielectric strength, and operates at a junction temperature up to 175°C. Mounted in a surface-mount SMPD package, it weighs 8 g and includes a fast intrinsic diode with a reverse recovery time of 150 ns. The device is avalanche rated and meets thermal performance targets with a junction-to-case thermal resistance of 0.22 °C/W and junction-to-ambient of 30 °C/W.

Datasheet Summary
Powered by GS/AI

The MMIX1F360N15T2 is an N-channel enhancement mode power MOSFET with a 150 V drain-source breakdown voltage and a continuous drain current of 235 A at 25°C, designed for high-speed switching in DC-DC converters and UPS applications. It features a very low on-resistance of 4.4 mΩ, an isolated tab with 2500 V~ dielectric strength, and operates at a junction temperature up to 175°C. Mounted in a surface-mount SMPD package, it weighs 8 g and includes a fast intrinsic diode with a reverse recovery time of 150 ns. The device is avalanche rated and meets thermal performance targets with a junction-to-case thermal resistance of 0.22 °C/W and junction-to-ambient of 30 °C/W.

Suppliers

Company
Product
Description
Supplier Links
40V - 1100V HiPerFETs and MOSFETs in Surface Mount Power Device (SMPD) Packages - MMIX1F360N15T2 - Littelfuse, Inc.
Rosemont, IL, United States
40V - 1100V HiPerFETs and MOSFETs in Surface Mount Power Device (SMPD) Packages
MMIX1F360N15T2
40V - 1100V HiPerFETs and MOSFETs in Surface Mount Power Device (SMPD) Packages MMIX1F360N15T2
Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices. Configurations: Buck Boost Full-bridge Half-bridge Phase leg Single Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability

Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices. Configurations: Buck Boost Full-bridge Half-bridge Phase leg Single Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Transistors
Product Number MMIX1F360N15T2
Product Name 40V - 1100V HiPerFETs and MOSFETs in Surface Mount Power Device (SMPD) Packages
Package Type SMPD
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