Littelfuse, Inc. 40V - 1100V HiPerFETs and MOSFETs in Surface Mount Power Device (SMPD) Packages MMIX1F210N30P3

Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices. Configurations: Buck Boost Full-bridge Half-bridge Phase leg Single Ultra-low and compact package profile Surface mountable via standard reflow process Low package weight Up to 4.5 kV ceramic isolation (DCB) Low package inductance Excellent thermal performance High power cycling capability