Littelfuse, Inc. 1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs IXYX30N170CV1

Description
Designed using the proprietary thin-wafer XPT™ technology and state-of-the-art IGBT process, these devices display qualities such as reduced thermal resistance, low tail current, low energy loss, and high-speed switching capability. Thanks to the positive temperature coefficient of their on-state voltage, these high-voltage IGBTs can be used in parallel, which provides cost-effective solutions compared to series-connected, lower-voltage devices. Consequently, this results in reduction in the associated gate drive circuitry, simplicity in design, and improvement in the reliability of the overall system. The optional co-packed fast recovery diodes have low reverse recovery time and are optimized to produce smooth switching waveforms and significantly lower electromagnetic interference (EMI). Advantages: Higher efficiency Elimination of multiple series-connected devices Increased reliability of power systems Thin wafer XPT™ technology Low on-state voltages VCE(sat) Co-packed fast recovery diodes Positive temperature coefficient of VCE(sat) International standard size high-voltage packages
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Description
Designed using the proprietary thin-wafer XPT™ technology and state-of-the-art IGBT process, these devices display qualities such as reduced thermal resistance, low tail current, low energy loss, and high-speed switching capability. Thanks to the positive temperature coefficient of their on-state voltage, these high-voltage IGBTs can be used in parallel, which provides cost-effective solutions compared to series-connected, lower-voltage devices. Consequently, this results in reduction in the associated gate drive circuitry, simplicity in design, and improvement in the reliability of the overall system. The optional co-packed fast recovery diodes have low reverse recovery time and are optimized to produce smooth switching waveforms and significantly lower electromagnetic interference (EMI). Advantages: Higher efficiency Elimination of multiple series-connected devices Increased reliability of power systems Thin wafer XPT™ technology Low on-state voltages VCE(sat) Co-packed fast recovery diodes Positive temperature coefficient of VCE(sat) International standard size high-voltage packages
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs - IXYX30N170CV1 - Littelfuse, Inc.
Rosemont, IL, United States
1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs
IXYX30N170CV1
1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs IXYX30N170CV1
Designed using the proprietary thin-wafer XPT™ technology and state-of-the-art IGBT process, these devices display qualities such as reduced thermal resistance, low tail current, low energy loss, and high-speed switching capability. Thanks to the positive temperature coefficient of their on-state voltage, these high-voltage IGBTs can be used in parallel, which provides cost-effective solutions compared to series-connected, lower-voltage devices. Consequently, this results in reduction in the associated gate drive circuitry, simplicity in design, and improvement in the reliability of the overall system. The optional co-packed fast recovery diodes have low reverse recovery time and are optimized to produce smooth switching waveforms and significantly lower electromagnetic interference (EMI). Advantages: Higher efficiency Elimination of multiple series-connected devices Increased reliability of power systems Thin wafer XPT™ technology Low on-state voltages VCE(sat) Co-packed fast recovery diodes Positive temperature coefficient of VCE(sat) International standard size high-voltage packages

Designed using the proprietary thin-wafer XPT™ technology and state-of-the-art IGBT process, these devices display qualities such as reduced thermal resistance, low tail current, low energy loss, and high-speed switching capability. Thanks to the positive temperature coefficient of their on-state voltage, these high-voltage IGBTs can be used in parallel, which provides cost-effective solutions compared to series-connected, lower-voltage devices. Consequently, this results in reduction in the associated gate drive circuitry, simplicity in design, and improvement in the reliability of the overall system. The optional co-packed fast recovery diodes have low reverse recovery time and are optimized to produce smooth switching waveforms and significantly lower electromagnetic interference (EMI). Advantages: Higher efficiency Elimination of multiple series-connected devices Increased reliability of power systems Thin wafer XPT™ technology Low on-state voltages VCE(sat) Co-packed fast recovery diodes Positive temperature coefficient of VCE(sat) International standard size high-voltage packages

Supplier's Site Datasheet
IGBTs - 1464254 - RS Components, Ltd.
Corby, Northants, United Kingdom
IGBTs
1464254
IGBTs 1464254
XPT IGBT 30A 500V PLUS247

XPT IGBT 30A 500V PLUS247

Supplier's Site
IGBTs - 1464408 - RS Components, Ltd.
Corby, Northants, United Kingdom
IGBTs
1464408
IGBTs 1464408
XPT IGBT 30A 1700V PLUS247

XPT IGBT 30A 1700V PLUS247

Supplier's Site
Transistor, Igbt, 1.7Kv, 100A, Plus247; Continuous Collector Current Littelfuse - 03AH2130 - Newark, An Avnet Company
Chicago, IL, United States
Transistor, Igbt, 1.7Kv, 100A, Plus247; Continuous Collector Current Littelfuse
03AH2130
Transistor, Igbt, 1.7Kv, 100A, Plus247; Continuous Collector Current Littelfuse 03AH2130
TRANSISTOR, IGBT, 1.7KV, 100A, PLUS247; Continuous Collector Current:100A; Collector Emitter Saturation Voltage:3.5V; Power Dissipation:937W; Collector Emitter Voltage Max:1.7kV; No. of Pins:3Pins; Operating Temperature Max:175°C RoHS Compliant: Yes

TRANSISTOR, IGBT, 1.7KV, 100A, PLUS247; Continuous Collector Current:100A; Collector Emitter Saturation Voltage:3.5V; Power Dissipation:937W; Collector Emitter Voltage Max:1.7kV; No. of Pins:3Pins; Operating Temperature Max:175°C RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc. RS Components, Ltd. Newark, An Avnet Company
Product Category Insulated Gate Bipolar Transistors (IGBT) Insulated Gate Bipolar Transistors (IGBT) Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYX30N170CV1 1464254 03AH2130
Product Name 1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs IGBTs Transistor, Igbt, 1.7Kv, 100A, Plus247; Continuous Collector Current Littelfuse
VCES 1700 volts
VCE(on) 4 volts
IC(max) 100 amps
Package Type TO-247; TO-247 PLUS Plus247 TO-3
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