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Littelfuse, Inc. 1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs IXYX25N250CV1HV

Description
Designed using the proprietary thin-wafer XPT™ technology and state-of-the-art IGBT process, these devices display qualities such as reduced thermal resistance, low tail current, low energy loss, and high-speed switching capability. Thanks to the positive temperature coefficient of their on-state voltage, these high-voltage IGBTs can be used in parallel, which provides cost-effective solutions compared to series-connected, lower-voltage devices. Consequently, this results in reduction in the associated gate drive circuitry, simplicity in design, and improvement in the reliability of the overall system. The optional co-packed fast recovery diodes have low reverse recovery time and are optimized to produce smooth switching waveforms and significantly lower electromagnetic interference (EMI). Features: Thin wafer XPT™ technology Low on-state voltages VCE(sat) Co-packed fast recovery diodes Positive temperature coefficient of VCE(sat) International standard size high-voltage packages Applications: Pulser circuits Laser and X-ray generators High-voltage power supplies High-voltage test equipment Capacitor discharge circuits AC switches Advantages: Higher efficiency Elimination of multiple series-connected devices Increased reliability of power systems
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Suppliers

Company
Product
Description
Supplier Links
1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs - IXYX25N250CV1HV - Littelfuse, Inc.
Chicago, IL, United States
1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs
IXYX25N250CV1HV
1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs IXYX25N250CV1HV
Designed using the proprietary thin-wafer XPT™ technology and state-of-the-art IGBT process, these devices display qualities such as reduced thermal resistance, low tail current, low energy loss, and high-speed switching capability. Thanks to the positive temperature coefficient of their on-state voltage, these high-voltage IGBTs can be used in parallel, which provides cost-effective solutions compared to series-connected, lower-voltage devices. Consequently, this results in reduction in the associated gate drive circuitry, simplicity in design, and improvement in the reliability of the overall system. The optional co-packed fast recovery diodes have low reverse recovery time and are optimized to produce smooth switching waveforms and significantly lower electromagnetic interference (EMI). Features: Thin wafer XPT™ technology Low on-state voltages VCE(sat) Co-packed fast recovery diodes Positive temperature coefficient of VCE(sat) International standard size high-voltage packages Applications: Pulser circuits Laser and X-ray generators High-voltage power supplies High-voltage test equipment Capacitor discharge circuits AC switches Advantages: Higher efficiency Elimination of multiple series-connected devices Increased reliability of power systems

Designed using the proprietary thin-wafer XPT™ technology and state-of-the-art IGBT process, these devices display qualities such as reduced thermal resistance, low tail current, low energy loss, and high-speed switching capability. Thanks to the positive temperature coefficient of their on-state voltage, these high-voltage IGBTs can be used in parallel, which provides cost-effective solutions compared to series-connected, lower-voltage devices. Consequently, this results in reduction in the associated gate drive circuitry, simplicity in design, and improvement in the reliability of the overall system. The optional co-packed fast recovery diodes have low reverse recovery time and are optimized to produce smooth switching waveforms and significantly lower electromagnetic interference (EMI). Features: Thin wafer XPT™ technology Low on-state voltages VCE(sat) Co-packed fast recovery diodes Positive temperature coefficient of VCE(sat) International standard size high-voltage packages Applications: Pulser circuits Laser and X-ray generators High-voltage power supplies High-voltage test equipment Capacitor discharge circuits AC switches Advantages: Higher efficiency Elimination of multiple series-connected devices Increased reliability of power systems

Supplier's Site Datasheet
 - 1464257 - RS Components, Ltd.
Corby, Northants, United Kingdom
XPT IGBT 25A 2500V TO247PLUS-HV - Discrete Semiconductors - IGBT Transistors

XPT IGBT 25A 2500V TO247PLUS-HV - Discrete Semiconductors - IGBT Transistors

Supplier's Site
 - 1464362 - RS Components, Ltd.
Corby, Northants, United Kingdom
XPT IGBT 25A 2500V TO247PLUS-HV - Discrete Semiconductors - IGBT Transistors

XPT IGBT 25A 2500V TO247PLUS-HV - Discrete Semiconductors - IGBT Transistors

Supplier's Site

Technical Specifications

  Littelfuse, Inc. RS Components, Ltd.
Product Category Insulated Gate Bipolar Transistors (IGBT) Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYX25N250CV1HV 1464257
Product Name 1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 2500 volts
VCE(on) 4 volts
IC(max) 95 amps 95 amps
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