Littelfuse, Inc. 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYX100N65C3D1

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXYX100N65C3D1 is a 650V IGBT with a 100A collector current rating, designed for 20-60kHz switching applications in power inverters, motor drives, UPS, PFC circuits, and battery chargers. It features an anti-parallel ultra-fast diode and is housed in the PLUS247 package, weighing 6g. The device has a maximum junction temperature of 175°C, a saturated collector-emitter voltage of 2.3V at 100A and 15V gate-emitter voltage, and a thermal resistance from junction to case of 0.15°C/W for the mount surface. It is avalanche-rated, has a square RBSOA, and short-circuit capability with a clamped inductive turn-off time of 60ns at 150°C. The IGBT meets the AEC-Q200 standard and RoHS compliance, and is optimized for low gate drive requirements and high power density.

Datasheet Summary
Powered by GS/AI

The IXYX100N65C3D1 is a 650V IGBT with a 100A collector current rating, designed for 20-60kHz switching applications in power inverters, motor drives, UPS, PFC circuits, and battery chargers. It features an anti-parallel ultra-fast diode and is housed in the PLUS247 package, weighing 6g. The device has a maximum junction temperature of 175°C, a saturated collector-emitter voltage of 2.3V at 100A and 15V gate-emitter voltage, and a thermal resistance from junction to case of 0.15°C/W for the mount surface. It is avalanche-rated, has a square RBSOA, and short-circuit capability with a clamped inductive turn-off time of 60ns at 150°C. The IGBT meets the AEC-Q200 standard and RoHS compliance, and is optimized for low gate drive requirements and high power density.

Suppliers

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600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs - IXYX100N65C3D1 - Littelfuse, Inc.
Rosemont, IL, United States
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
IXYX100N65C3D1
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYX100N65C3D1
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYX100N65C3D1
Product Name 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 650 volts
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