Littelfuse, Inc. 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYT30N65C3H1HV

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXYT30N65C3H1HV is a 650V IGBT designed for 20-60kHz switching applications, featuring a TO-268HV package. It has a continuous collector current rating of 30A at 110°C and a peak collector current of 118A for 1ms. The device exhibits a collector-emitter saturation voltage of 2.35V to 2.70V at 30A and 15V gate-emitter voltage, with a turn-on time of 42ns and turn-off time of 75ns at 25°C. It includes an anti-parallel sonic diode with a forward voltage of 2.5V at 30A and a reverse recovery time of 120ns at 150°C. The IGBT is avalanche-rated, has a square RBSOA, and supports short-circuit operation for 8μs. Thermal resistance from junction to case is 0.55°C/W. Operating junction temperature ranges from -55°C to 175°C.

Datasheet Summary
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The IXYT30N65C3H1HV is a 650V IGBT designed for 20-60kHz switching applications, featuring a TO-268HV package. It has a continuous collector current rating of 30A at 110°C and a peak collector current of 118A for 1ms. The device exhibits a collector-emitter saturation voltage of 2.35V to 2.70V at 30A and 15V gate-emitter voltage, with a turn-on time of 42ns and turn-off time of 75ns at 25°C. It includes an anti-parallel sonic diode with a forward voltage of 2.5V at 30A and a reverse recovery time of 120ns at 150°C. The IGBT is avalanche-rated, has a square RBSOA, and supports short-circuit operation for 8μs. Thermal resistance from junction to case is 0.55°C/W. Operating junction temperature ranges from -55°C to 175°C.

Suppliers

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600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs - IXYT30N65C3H1HV - Littelfuse, Inc.
Rosemont, IL, United States
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
IXYT30N65C3H1HV
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYT30N65C3H1HV
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYT30N65C3H1HV
Product Name 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 650 volts
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