Littelfuse, Inc. 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYR50N120C3D1

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXYR50N120C3D1 is a 1200V XPT IGBT with an integrated ultra-fast anti-parallel diode, designed for high-frequency switching applications up to 50 kHz. It is packaged in an ISOPLUS247 case with an electrically isolated tab and weighs 5 g. The device has a continuous collector current rating of 32 A at 90°C and a maximum collector-emitter voltage of 1200 V. Its collector-emitter saturation voltage is 3.5 V at 25°C and 4.2 V at 150°C with I_C = 50 A and V_GE = 15 V. The thermal resistance from junction to case is 0.43 °C/W. It features a square RBSOA, positive thermal coefficient of V_CE(sat), and meets RoHS standards. The device is qualified for industrial use with an operating junction temperature range of -55 °C to 150 °C.

Datasheet Summary
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The IXYR50N120C3D1 is a 1200V XPT IGBT with an integrated ultra-fast anti-parallel diode, designed for high-frequency switching applications up to 50 kHz. It is packaged in an ISOPLUS247 case with an electrically isolated tab and weighs 5 g. The device has a continuous collector current rating of 32 A at 90°C and a maximum collector-emitter voltage of 1200 V. Its collector-emitter saturation voltage is 3.5 V at 25°C and 4.2 V at 150°C with I_C = 50 A and V_GE = 15 V. The thermal resistance from junction to case is 0.43 °C/W. It features a square RBSOA, positive thermal coefficient of V_CE(sat), and meets RoHS standards. The device is qualified for industrial use with an operating junction temperature range of -55 °C to 150 °C.

Suppliers

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600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs - IXYR50N120C3D1 - Littelfuse, Inc.
Rosemont, IL, United States
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
IXYR50N120C3D1
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYR50N120C3D1
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYR50N120C3D1
Product Name 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 1200 volts
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