Littelfuse, Inc. Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYQ30N65B3D1 IXYQ30N65B3D1

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXYQ30N65B3D1 is a 650V, 30A IGBT with an integrated fast anti-parallel diode, designed for 5-30 kHz switching in power inverters, motor drives, and PFC circuits. It is packaged in a TO-3P case, weighing 5.5 g, with a maximum junction temperature of 175°C and a power dissipation of 270 W at 25°C. The device features a square RBSOA, avalanche ruggedness, and short-circuit capability with a maximum pulse width of 5 μs. Its collector-emitter saturation voltage is 1.8-2.1 V at 30 A and 15 V gate drive. Thermal resistance is 0.60 °C/W from junction to case for the diode and 0.55 °C/W for the IGBT. The part meets RoHS standards and is rated for operating temperatures from -55°C to 175°C.

Datasheet Summary
Powered by GS/AI

The IXYQ30N65B3D1 is a 650V, 30A IGBT with an integrated fast anti-parallel diode, designed for 5-30 kHz switching in power inverters, motor drives, and PFC circuits. It is packaged in a TO-3P case, weighing 5.5 g, with a maximum junction temperature of 175°C and a power dissipation of 270 W at 25°C. The device features a square RBSOA, avalanche ruggedness, and short-circuit capability with a maximum pulse width of 5 μs. Its collector-emitter saturation voltage is 1.8-2.1 V at 30 A and 15 V gate drive. Thermal resistance is 0.60 °C/W from junction to case for the diode and 0.55 °C/W for the IGBT. The part meets RoHS standards and is rated for operating temperatures from -55°C to 175°C.

Suppliers

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Product
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Supplier Links
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYQ30N65B3D1 - IXYQ30N65B3D1 - Littelfuse, Inc.
Rosemont, IL, United States
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYQ30N65B3D1
IXYQ30N65B3D1
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYQ30N65B3D1 IXYQ30N65B3D1
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYQ30N65B3D1
Product Name Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYQ30N65B3D1
VCES 650 volts
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