Littelfuse, Inc. 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYP30N120C3

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXYP30N120C3 is a 1200 V, 30 A insulated gate bipolar transistor (IGBT) in a TO-220 package, designed for high-frequency switching applications up to 50 kHz. It features a collector-emitter saturation voltage of 3.3 V at 30 A and 15 V gate-emitter voltage, with a maximum junction temperature of 175 °C and thermal resistance from junction to case of 0.30 °C/W. The device supports a reverse bias safe operating area (RBSOA) up to 1200 V and is avalanche rated, with a square RBSOA profile. It complies with international standard packaging and is optimized for low switching losses, low gate drive requirements, and high power density. The TO-220 package weighs 3 g and has dimensions of 20.80-21.46 mm in length, 15.75-16.26 mm in width, and 4.70-5.30 mm in height. The device meets AEC-Q200 qualification and is RoHS compliant.

Datasheet Summary
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The IXYP30N120C3 is a 1200 V, 30 A insulated gate bipolar transistor (IGBT) in a TO-220 package, designed for high-frequency switching applications up to 50 kHz. It features a collector-emitter saturation voltage of 3.3 V at 30 A and 15 V gate-emitter voltage, with a maximum junction temperature of 175 °C and thermal resistance from junction to case of 0.30 °C/W. The device supports a reverse bias safe operating area (RBSOA) up to 1200 V and is avalanche rated, with a square RBSOA profile. It complies with international standard packaging and is optimized for low switching losses, low gate drive requirements, and high power density. The TO-220 package weighs 3 g and has dimensions of 20.80-21.46 mm in length, 15.75-16.26 mm in width, and 4.70-5.30 mm in height. The device meets AEC-Q200 qualification and is RoHS compliant.

Suppliers

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Supplier Links
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs - IXYP30N120C3 - Littelfuse, Inc.
Rosemont, IL, United States
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
IXYP30N120C3
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYP30N120C3
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYP30N120C3
Product Name 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 1200 volts
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