Littelfuse, Inc. Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs IXYP20N120C4

Description
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these up to 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low gate drive requirements Low on-state voltages Vcesat Optimized for high switching frequencies up to 60kHz Positive thermal coefficient of Vcesat International standard packages
Description
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these up to 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low gate drive requirements Low on-state voltages Vcesat Optimized for high switching frequencies up to 60kHz Positive thermal coefficient of Vcesat International standard packages
Datasheet
Datasheet Summary
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The IXYP20N120C4 is a 1200V, 20A silicon IGBT in a TO-220 package, designed for high-frequency switching applications between 20 and 50 kHz. It has a maximum collector-emitter voltage of 1200 V, a collector current rating of 20 A continuous and 120 A peak, and a maximum power dissipation of 375 W. The device features a typical collector-emitter saturation voltage of 2.5 V at 20 A and 15 V gate drive, with a thermal resistance from junction to case of 0.50 °C/W. Switching times are specified with a fall time of 58 ns and turn-off energy of 1.0 mJ. It has a positive thermal coefficient for Vce(sat), supports clamped inductive switching, and operates from -55°C to 175°C junction temperature. The TO-220 package weighs 3.0 g and has a mounting torque of 1.13 Nm.

Datasheet Summary
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The IXYP20N120C4 is a 1200V, 20A silicon IGBT in a TO-220 package, designed for high-frequency switching applications between 20 and 50 kHz. It has a maximum collector-emitter voltage of 1200 V, a collector current rating of 20 A continuous and 120 A peak, and a maximum power dissipation of 375 W. The device features a typical collector-emitter saturation voltage of 2.5 V at 20 A and 15 V gate drive, with a thermal resistance from junction to case of 0.50 °C/W. Switching times are specified with a fall time of 58 ns and turn-off energy of 1.0 mJ. It has a positive thermal coefficient for Vce(sat), supports clamped inductive switching, and operates from -55°C to 175°C junction temperature. The TO-220 package weighs 3.0 g and has a mounting torque of 1.13 Nm.

Suppliers

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Supplier Links
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs - IXYP20N120C4 - Littelfuse, Inc.
Rosemont, IL, United States
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs
IXYP20N120C4
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs IXYP20N120C4
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these up to 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low gate drive requirements Low on-state voltages Vcesat Optimized for high switching frequencies up to 60kHz Positive thermal coefficient of Vcesat International standard packages

Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these up to 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low gate drive requirements Low on-state voltages Vcesat Optimized for high switching frequencies up to 60kHz Positive thermal coefficient of Vcesat International standard packages

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYP20N120C4
Product Name Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 1200 volts
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