Littelfuse, Inc. Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs IXYP20N120B4

Description
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low gate drive requirements Low on-state voltages Vcesat Optimized for medium switching frequencies 10kHz up to 30kHz Positive thermal coefficient of Vcesat International standard packages
Description
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low gate drive requirements Low on-state voltages Vcesat Optimized for medium switching frequencies 10kHz up to 30kHz Positive thermal coefficient of Vcesat International standard packages
Datasheet
Datasheet Summary
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The IXYP20N120B4 is a 1200V, 20A continuous IGBT in a TO-220 package, optimized for switching frequencies between 5 kHz and 30 kHz. It has a maximum collector-emitter voltage of 1200 V, a collector current rating of 20 A at 110°C, and a peak collector current of 130 A for 1 ms. The saturated collector-emitter voltage is 2.10 V at 25°C and 20 A gate drive, with a positive temperature coefficient. Thermal resistance from junction to case is 0.50 °C/W. The device is rated for junction temperatures from -55°C to 175°C and meets international standard package requirements. It is suited for power inverters, UPS, motor drives, SMPS, battery chargers, and welding machines.

Datasheet Summary
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The IXYP20N120B4 is a 1200V, 20A continuous IGBT in a TO-220 package, optimized for switching frequencies between 5 kHz and 30 kHz. It has a maximum collector-emitter voltage of 1200 V, a collector current rating of 20 A at 110°C, and a peak collector current of 130 A for 1 ms. The saturated collector-emitter voltage is 2.10 V at 25°C and 20 A gate drive, with a positive temperature coefficient. Thermal resistance from junction to case is 0.50 °C/W. The device is rated for junction temperatures from -55°C to 175°C and meets international standard package requirements. It is suited for power inverters, UPS, motor drives, SMPS, battery chargers, and welding machines.

Suppliers

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Supplier Links
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs - IXYP20N120B4 - Littelfuse, Inc.
Rosemont, IL, United States
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs
IXYP20N120B4
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs IXYP20N120B4
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low gate drive requirements Low on-state voltages Vcesat Optimized for medium switching frequencies 10kHz up to 30kHz Positive thermal coefficient of Vcesat International standard packages

Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low gate drive requirements Low on-state voltages Vcesat Optimized for medium switching frequencies 10kHz up to 30kHz Positive thermal coefficient of Vcesat International standard packages

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYP20N120B4
Product Name Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 1200 volts
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