Littelfuse, Inc. Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs IXYP20N120A4

Description
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these up to 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low on-state voltages Vcesat Positive thermal coefficient of Vcesat International standard packages
Description
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these up to 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low on-state voltages Vcesat Positive thermal coefficient of Vcesat International standard packages
Datasheet
Datasheet Summary
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The IXYP20N120A4 is a 1200V, 20A continuous IGBT in a TO-220 package, designed for high-power switching applications up to 5kHz. It features a maximum collector-emitter voltage of 1200V, a collector current rating of 20A at 110°C, and a typical saturated voltage of 1.90V at 20A and 15V gate drive. The device has a thermal resistance of 0.50 °C/W from case to sink and operates with a junction temperature range of -55°C to 175°C. It exhibits a positive thermal coefficient for Vce(sat), enabling parallel operation, and meets international standard package requirements. The IGBT is qualified for use in power inverters, UPS, motor drives, SMPS, battery chargers, welding machines, and lamp ballasts.

Datasheet Summary
Powered by GS/AI

The IXYP20N120A4 is a 1200V, 20A continuous IGBT in a TO-220 package, designed for high-power switching applications up to 5kHz. It features a maximum collector-emitter voltage of 1200V, a collector current rating of 20A at 110°C, and a typical saturated voltage of 1.90V at 20A and 15V gate drive. The device has a thermal resistance of 0.50 °C/W from case to sink and operates with a junction temperature range of -55°C to 175°C. It exhibits a positive thermal coefficient for Vce(sat), enabling parallel operation, and meets international standard package requirements. The IGBT is qualified for use in power inverters, UPS, motor drives, SMPS, battery chargers, welding machines, and lamp ballasts.

Suppliers

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Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs - IXYP20N120A4 - Littelfuse, Inc.
Rosemont, IL, United States
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs
IXYP20N120A4
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs IXYP20N120A4
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these up to 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low on-state voltages Vcesat Positive thermal coefficient of Vcesat International standard packages

Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these up to 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low on-state voltages Vcesat Positive thermal coefficient of Vcesat International standard packages

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYP20N120A4
Product Name Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 1200 volts
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