Littelfuse, Inc. Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP15N65C3D1M IXYP15N65C3D1M

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXYP15N65C3D1M is a 650V IGBT with an integrated fast diode, designed for 20-60 kHz switching applications such as power inverters, UPS, motor drives, and PFC circuits. It is packaged in an overmolded TO-220 case with an electrically isolated tab and weighs 2.5 g. The device has a continuous collector current rating of 9 A at 110°C and a maximum collector-emitter voltage of 650 V. It features a collector-emitter saturation voltage of 1.96 V (typical) at 15 A and 15 V gate-emitter voltage, with a thermal resistance junction-to-case of 2.63 °C/W. The IGBT is avalanche rated, has a square reverse bias safe operating area, and supports short-circuit operation up to 8 µs. It meets a 2500 V~ isolation rating and operates with a junction temperature range of -55°C to 175°C.

Datasheet Summary
Powered by GS/AI

The IXYP15N65C3D1M is a 650V IGBT with an integrated fast diode, designed for 20-60 kHz switching applications such as power inverters, UPS, motor drives, and PFC circuits. It is packaged in an overmolded TO-220 case with an electrically isolated tab and weighs 2.5 g. The device has a continuous collector current rating of 9 A at 110°C and a maximum collector-emitter voltage of 650 V. It features a collector-emitter saturation voltage of 1.96 V (typical) at 15 A and 15 V gate-emitter voltage, with a thermal resistance junction-to-case of 2.63 °C/W. The IGBT is avalanche rated, has a square reverse bias safe operating area, and supports short-circuit operation up to 8 µs. It meets a 2500 V~ isolation rating and operates with a junction temperature range of -55°C to 175°C.

Suppliers

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Product
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Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP15N65C3D1M - IXYP15N65C3D1M - Littelfuse, Inc.
Rosemont, IL, United States
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP15N65C3D1M
IXYP15N65C3D1M
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP15N65C3D1M IXYP15N65C3D1M
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYP15N65C3D1M
Product Name Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP15N65C3D1M
VCES 650 volts
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