Littelfuse, Inc. Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP10N65C3D1M IXYP10N65C3D1M

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXYP10N65C3D1M is a 650V planar IGBT with an integrated fast anti-parallel diode, designed for 20-60kHz switching applications in power inverters, UPS, motor drives, and PFC circuits. It is packaged in an overmolded TO-220 case with an electrically isolated tab, rated for 2500V~ isolation. The device has a continuous collector current of 7A at 110°C and a peak current of 50A at 25°C for 1ms. The collector-emitter saturation voltage is 2.27V to 2.60V at 10A and 15V gate drive. Thermal resistance is 2.83°C/W from junction to case. The IGBT is avalanche rated, features square RBSOA, and has a maximum junction temperature of 175°C. It meets the RoHS standard and is designed for high power density and low gate drive requirements.

Datasheet Summary
Powered by GS/AI

The IXYP10N65C3D1M is a 650V planar IGBT with an integrated fast anti-parallel diode, designed for 20-60kHz switching applications in power inverters, UPS, motor drives, and PFC circuits. It is packaged in an overmolded TO-220 case with an electrically isolated tab, rated for 2500V~ isolation. The device has a continuous collector current of 7A at 110°C and a peak current of 50A at 25°C for 1ms. The collector-emitter saturation voltage is 2.27V to 2.60V at 10A and 15V gate drive. Thermal resistance is 2.83°C/W from junction to case. The IGBT is avalanche rated, features square RBSOA, and has a maximum junction temperature of 175°C. It meets the RoHS standard and is designed for high power density and low gate drive requirements.

Suppliers

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Product
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Supplier Links
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP10N65C3D1M - IXYP10N65C3D1M - Littelfuse, Inc.
Rosemont, IL, United States
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP10N65C3D1M
IXYP10N65C3D1M
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP10N65C3D1M IXYP10N65C3D1M
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYP10N65C3D1M
Product Name Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP10N65C3D1M
VCES 650 volts
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