Littelfuse, Inc. 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYP10N65C3

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXYP10N65C3 is a 650V IGBT designed for switching applications in the 20-60kHz range, optimized for high power density and rugged operation in inverters, motor drives, UPS, and PFC circuits. It is packaged in a TO-220 case with a weight of 3g and a mounting torque specification of 1.13 Nm. The device has a continuous collector current rating of 10A at 110°C and a peak collector current of 54A at 25°C for 1ms. It features a collector-emitter saturation voltage of 2.50V at 10A and 15V gate-emitter voltage, and a thermal resistance from junction to case of 0.94°C/W. The IGBT is rated for a maximum junction temperature of 175°C, has a square RBSOA, avalanche capability, and a short-circuit withstand time of 8μs at VCE=360V. It meets international standard package requirements and has low gate drive requirements.

Datasheet Summary
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The IXYP10N65C3 is a 650V IGBT designed for switching applications in the 20-60kHz range, optimized for high power density and rugged operation in inverters, motor drives, UPS, and PFC circuits. It is packaged in a TO-220 case with a weight of 3g and a mounting torque specification of 1.13 Nm. The device has a continuous collector current rating of 10A at 110°C and a peak collector current of 54A at 25°C for 1ms. It features a collector-emitter saturation voltage of 2.50V at 10A and 15V gate-emitter voltage, and a thermal resistance from junction to case of 0.94°C/W. The IGBT is rated for a maximum junction temperature of 175°C, has a square RBSOA, avalanche capability, and a short-circuit withstand time of 8μs at VCE=360V. It meets international standard package requirements and has low gate drive requirements.

Suppliers

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600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs - IXYP10N65C3 - Littelfuse, Inc.
Rosemont, IL, United States
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
IXYP10N65C3
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYP10N65C3
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYP10N65C3
Product Name 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 650 volts
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