Littelfuse, Inc. Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP10N65B3D1 IXYP10N65B3D1

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXYP10N65B3D1 is a 650V IGBT with a 10A continuous collector current, designed for 5-30kHz switching applications in power inverters, UPS, motor drives, SMPS, PFC circuits, battery chargers, welding machines, and lamp ballasts. It is packaged in a TO-220 case with a weight of 2.5 g and has an anti-parallel fast diode. The device features a square RBSOA, avalanche capability, short circuit tolerance, and low gate drive requirements. Thermal resistance from junction to case is 0.94 °C/W for the IGBT and 2.30 °C/W for the diode. It meets international standard package requirements and is rated for operation from -55°C to 175°C junction temperature. The IGBT is optimized for high power density and rugged performance in hard-switching environments.

Datasheet Summary
Powered by GS/AI

The IXYP10N65B3D1 is a 650V IGBT with a 10A continuous collector current, designed for 5-30kHz switching applications in power inverters, UPS, motor drives, SMPS, PFC circuits, battery chargers, welding machines, and lamp ballasts. It is packaged in a TO-220 case with a weight of 2.5 g and has an anti-parallel fast diode. The device features a square RBSOA, avalanche capability, short circuit tolerance, and low gate drive requirements. Thermal resistance from junction to case is 0.94 °C/W for the IGBT and 2.30 °C/W for the diode. It meets international standard package requirements and is rated for operation from -55°C to 175°C junction temperature. The IGBT is optimized for high power density and rugged performance in hard-switching environments.

Suppliers

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Product
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Supplier Links
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP10N65B3D1 - IXYP10N65B3D1 - Littelfuse, Inc.
Rosemont, IL, United States
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP10N65B3D1
IXYP10N65B3D1
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP10N65B3D1 IXYP10N65B3D1
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYP10N65B3D1
Product Name Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYP10N65B3D1
VCES 650 volts
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