Littelfuse, Inc. Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYN100N65B3D1 IXYN100N65B3D1

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXYN100N65B3D1 is a 650V IGBT with a 100A continuous collector current rating at 110°C, designed for switching applications in the 10-30 kHz range. It is housed in a SOT-227B miniBLOC package, weighing 30 g, and includes an anti-parallel fr diode. The device has a maximum collector-emitter voltage of 650 V, a gate-emitter voltage rating of ±20 V continuous and ±30 V transient, and a short-circuit withstand time of 8 μs. It features square RBSOA, 2500 V~ isolation voltage, and a mounting torque of 1.5 Nm. Thermal resistance from junction to case is 0.25 °C/W for the IGBT and 0.40 °C/W for the diode. Its collector-emitter saturation voltage is 1.85 V at 70 A and 15 V gate drive. Maximum junction temperature is 175°C.

Datasheet Summary
Powered by GS/AI

The IXYN100N65B3D1 is a 650V IGBT with a 100A continuous collector current rating at 110°C, designed for switching applications in the 10-30 kHz range. It is housed in a SOT-227B miniBLOC package, weighing 30 g, and includes an anti-parallel fr diode. The device has a maximum collector-emitter voltage of 650 V, a gate-emitter voltage rating of ±20 V continuous and ±30 V transient, and a short-circuit withstand time of 8 μs. It features square RBSOA, 2500 V~ isolation voltage, and a mounting torque of 1.5 Nm. Thermal resistance from junction to case is 0.25 °C/W for the IGBT and 0.40 °C/W for the diode. Its collector-emitter saturation voltage is 1.85 V at 70 A and 15 V gate drive. Maximum junction temperature is 175°C.

Suppliers

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Supplier Links
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYN100N65B3D1 - IXYN100N65B3D1 - Littelfuse, Inc.
Rosemont, IL, United States
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYN100N65B3D1
IXYN100N65B3D1
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYN100N65B3D1 IXYN100N65B3D1
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYN100N65B3D1
Product Name Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYN100N65B3D1
VCES 650 volts
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