Littelfuse, Inc. 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYN100N65A3

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
Powered by GS/AI

The IXYN100N65A3 is a 650V XPT™ IGBT in a SOT-227B miniBLOC package, designed for switching applications up to 5kHz with low conduction and switching losses. It has a collector current rating of 100A at 110°C and 170A at 25°C, with a collector-emitter saturation voltage of 1.80V maximum at 70A and 15V gate drive. The device features a square RBSOA, avalanche capability, and short-circuit tolerance, with a thermal resistance from junction to case of 0.25°C/W and isolation voltage of 2500V~. It is housed in an aluminum nitride isolated, international standard package with mounting torque of 1.5Nm and weighs 30g, rated for junction temperatures from -55°C to 175°C.

Datasheet Summary
Powered by GS/AI

The IXYN100N65A3 is a 650V XPT™ IGBT in a SOT-227B miniBLOC package, designed for switching applications up to 5kHz with low conduction and switching losses. It has a collector current rating of 100A at 110°C and 170A at 25°C, with a collector-emitter saturation voltage of 1.80V maximum at 70A and 15V gate drive. The device features a square RBSOA, avalanche capability, and short-circuit tolerance, with a thermal resistance from junction to case of 0.25°C/W and isolation voltage of 2500V~. It is housed in an aluminum nitride isolated, international standard package with mounting torque of 1.5Nm and weighs 30g, rated for junction temperatures from -55°C to 175°C.

Suppliers

Company
Product
Description
Supplier Links
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs - IXYN100N65A3 - Littelfuse, Inc.
Rosemont, IL, United States
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
IXYN100N65A3
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYN100N65A3
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet
Igbt, Module, 650V, 170A, Sot-227B; Continuous Collector Current Littelfuse - 03AH2083 - Newark, An Avnet Company
Chicago, IL, United States
Igbt, Module, 650V, 170A, Sot-227B; Continuous Collector Current Littelfuse
03AH2083
Igbt, Module, 650V, 170A, Sot-227B; Continuous Collector Current Littelfuse 03AH2083
IGBT, MODULE, 650V, 170A, SOT-227B; Continuous Collector Current:170A; Collector Emitter Saturation Voltage:1.44V; Power Dissipation:600W; Operating Temperature Max:175°C; IGBT Termination:Stud; Collector Emitter Voltage Max:650V RoHS Compliant: Yes

IGBT, MODULE, 650V, 170A, SOT-227B; Continuous Collector Current:170A; Collector Emitter Saturation Voltage:1.44V; Power Dissipation:600W; Operating Temperature Max:175°C; IGBT Termination:Stud; Collector Emitter Voltage Max:650V RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc. Newark, An Avnet Company
Product Category Insulated Gate Bipolar Transistors (IGBT) Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYN100N65A3 03AH2083
Product Name 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs Igbt, Module, 650V, 170A, Sot-227B; Continuous Collector Current Littelfuse
VCES 650 volts
VCE(on) 1.8 volts
IC(max) 170 amps
Unlock Full Specs
to access all available technical data

Similar Products

Igbt Module, 1200V, Econopack3; Continuous Collector Current Infineon - 61M5056 - Newark, An Avnet Company
Specs
PD 350000 milliwatts
TJ ? to 125 C (? to 257 F)
Package Type TO-3
View Details
2 suppliers
IGBTs - Single - HGTG27N60C3R - 873543-HGTG27N60C3R - Win Source Electronics
Specs
Package Type SOT3
Features IGBT
View Details
IGBT - 119337019 - Radwell International
Fuji Electric Corp. of America
View Details