Littelfuse, Inc. Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs IXYK85N120C4H1

Description
Developed using our proprietary XPT™ thin-wafer technology and state-of-the-art Trench IGBT process, these devices feature reduced thermal resistance, low energy losses, fast switching, low tail current, and high current densities. These IGBTs have breakdown voltage from 650V till 1200V, making them ideal for snubber-less hard-switching applications. Other qualities include a positive collector-to-emitter voltage temperature coefficient which enables designers to use multiple devices in parallel to meet high current requirements and low gate charges which help reduce gate drive requirements and switching losse Advantages: Hard-switching capabilities High power densities Temperature stability of diode forward voltage VF Low gate drive requirements Low Vcesat, low Eon/Eoff High surge current capability and short circuit capability Positive thermal coefficient of Vcesat
Description
Developed using our proprietary XPT™ thin-wafer technology and state-of-the-art Trench IGBT process, these devices feature reduced thermal resistance, low energy losses, fast switching, low tail current, and high current densities. These IGBTs have breakdown voltage from 650V till 1200V, making them ideal for snubber-less hard-switching applications. Other qualities include a positive collector-to-emitter voltage temperature coefficient which enables designers to use multiple devices in parallel to meet high current requirements and low gate charges which help reduce gate drive requirements and switching losse Advantages: Hard-switching capabilities High power densities Temperature stability of diode forward voltage VF Low gate drive requirements Low Vcesat, low Eon/Eoff High surge current capability and short circuit capability Positive thermal coefficient of Vcesat
Datasheet
Datasheet Summary
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The IXYK85N120C4H1 is a 1200 V, 85 A trench IGBT with an integrated anti-parallel sonic diode, designed for high-frequency switching applications between 20 and 50 kHz. It is packaged in a TO-264 case with a collector tab and weighs 10 g. The device features a collector-emitter saturation voltage of 2.50 V at 85 A and 15 V gate drive, a turn-off fall time of 37 ns, and a thermal resistance from junction to case of 0.13 K/W for the IGBT and 0.16 K/W for the diode. It meets AEC-Q200 and RoHS standards. The IGBT has a positive thermal coefficient of VCE(sat) and is optimized for low switching losses and high power density in inverters, PFC circuits, UPS, battery chargers, motor drives, and welding machines.

Datasheet Summary
Powered by GS/AI

The IXYK85N120C4H1 is a 1200 V, 85 A trench IGBT with an integrated anti-parallel sonic diode, designed for high-frequency switching applications between 20 and 50 kHz. It is packaged in a TO-264 case with a collector tab and weighs 10 g. The device features a collector-emitter saturation voltage of 2.50 V at 85 A and 15 V gate drive, a turn-off fall time of 37 ns, and a thermal resistance from junction to case of 0.13 K/W for the IGBT and 0.16 K/W for the diode. It meets AEC-Q200 and RoHS standards. The IGBT has a positive thermal coefficient of VCE(sat) and is optimized for low switching losses and high power density in inverters, PFC circuits, UPS, battery chargers, motor drives, and welding machines.

Suppliers

Company
Product
Description
Supplier Links
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs - IXYK85N120C4H1 - Littelfuse, Inc.
Rosemont, IL, United States
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs
IXYK85N120C4H1
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs IXYK85N120C4H1
Developed using our proprietary XPT™ thin-wafer technology and state-of-the-art Trench IGBT process, these devices feature reduced thermal resistance, low energy losses, fast switching, low tail current, and high current densities. These IGBTs have breakdown voltage from 650V till 1200V, making them ideal for snubber-less hard-switching applications. Other qualities include a positive collector-to-emitter voltage temperature coefficient which enables designers to use multiple devices in parallel to meet high current requirements and low gate charges which help reduce gate drive requirements and switching losse Advantages: Hard-switching capabilities High power densities Temperature stability of diode forward voltage VF Low gate drive requirements Low Vcesat, low Eon/Eoff High surge current capability and short circuit capability Positive thermal coefficient of Vcesat

Developed using our proprietary XPT™ thin-wafer technology and state-of-the-art Trench IGBT process, these devices feature reduced thermal resistance, low energy losses, fast switching, low tail current, and high current densities. These IGBTs have breakdown voltage from 650V till 1200V, making them ideal for snubber-less hard-switching applications. Other qualities include a positive collector-to-emitter voltage temperature coefficient which enables designers to use multiple devices in parallel to meet high current requirements and low gate charges which help reduce gate drive requirements and switching losse Advantages: Hard-switching capabilities High power densities Temperature stability of diode forward voltage VF Low gate drive requirements Low Vcesat, low Eon/Eoff High surge current capability and short circuit capability Positive thermal coefficient of Vcesat

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYK85N120C4H1
Product Name Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 1200 volts
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